32fb480e0a
RAPL "package" domains are actually implemented in hardware per-die. Thus, the new multi-die/package systems have mulitple domains within each physical package. Update the intel_rapl driver to be "die aware" -- exporting multiple domains within a single package, when present. No change on single die/package systems. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com> Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Reviewed-by: Ingo Molnar <mingo@kernel.org> Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org> Cc: linux-pm@vger.kernel.org Link: https://lkml.kernel.org/r/9fcb4719aeb7efccf3bc75ed8dd559e46121649f.1557769318.git.len.brown@intel.com |
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| idle_inject.c | ||
| intel_rapl.c | ||
| Kconfig | ||
| Makefile | ||
| powercap_sys.c | ||