d4e1f5a14e
Unlike the board branch, this keeps having large sets of changes for
every release, but that's quite expected and is so far working well.
Most of this is plumbing for various device bindings and new platforms,
but there's also a bit of cleanup and code removal for things that
are moved from platform code to DT contents (some OMAP clock code in
particular).
There's also a pinctrl driver for tegra here (appropriately acked),
that's introduced this way to make it more bisectable.
I'm happy to say that there were no conflicts at all with this branch
this release, which means that changes are flowing through our tree as
expected instead of merged through driver maintainers (or at least not
done with conflicts).
There are several new boards added, and a couple of SoCs. In no particular
order:
* Rockchip RK3288 SoC support, including DTS for a dev board that they
have seeded with some community developers.
* Better support for Hardkernel Exynos4-based ODROID boards.
* CCF conversions (and dtsi contents) for several Renesas platforms.
* Gumstix Pepper (TI AM335x) board support
* TI eval board support for AM437x
* Allwinner A23 SoC, very similar to existing ones which mostly has
resulted in DT changes for support. Also includes support for an Ippo
tablet with the chipset.
* Allwinner A31 Hummingbird board support, not to be confused with the
SolidRun i.MX-based Hummingboard.
* Tegra30 Apalis board support
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Merge tag 'dt-for-3.17' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc
Pull ARM SoC device-tree changes from Olof Johansson:
"Unlike the board branch, this keeps having large sets of changes for
every release, but that's quite expected and is so far working well.
Most of this is plumbing for various device bindings and new
platforms, but there's also a bit of cleanup and code removal for
things that are moved from platform code to DT contents (some OMAP
clock code in particular).
There's also a pinctrl driver for tegra here (appropriately acked),
that's introduced this way to make it more bisectable.
I'm happy to say that there were no conflicts at all with this branch
this release, which means that changes are flowing through our tree as
expected instead of merged through driver maintainers (or at least not
done with conflicts).
There are several new boards added, and a couple of SoCs. In no
particular order:
- Rockchip RK3288 SoC support, including DTS for a dev board that
they have seeded with some community developers.
- Better support for Hardkernel Exynos4-based ODROID boards.
- CCF conversions (and dtsi contents) for several Renesas platforms.
- Gumstix Pepper (TI AM335x) board support
- TI eval board support for AM437x
- Allwinner A23 SoC, very similar to existing ones which mostly has
resulted in DT changes for support. Also includes support for an
Ippo tablet with the chipset.
- Allwinner A31 Hummingbird board support, not to be confused with
the SolidRun i.MX-based Hummingboard.
- Tegra30 Apalis board support"
* tag 'dt-for-3.17' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (334 commits)
ARM: dts: Enable USB host0 (EHCI) on rk3288-evb
ARM: dts: add rk3288 ehci usb devices
ARM: dts: Turn on USB host vbus on rk3288-evb
ARM: tegra: apalis t30: fix device tree compatible node
ARM: tegra: paz00: Fix some indentation inconsistencies
ARM: zynq: DT: Clarify Xilinx Zynq platform
ARM: dts: rockchip: add watchdog node
ARM: dts: rockchip: remove pinctrl setting from radxarock uart2
ARM: dts: Add missing pinctrl for uart0/1 for exynos3250
ARM: dts: Remove duplicate 'interrput-parent' property for exynos3250
ARM: dts: Add TMU dt node to monitor the temperature for exynos3250
ARM: dts: Specify MAX77686 pmic interrupt for exynos5250-smdk5250
ARM: dts: cypress,cyapa trackpad is exynos5250-Snow only
ARM: dts: max77686 is exynos5250-snow only
ARM: zynq: DT: Remove DMA from board DTs
ARM: zynq: DT: Add CAN node
ARM: EXYNOS: Add exynos5260 PMU compatible string to DT match table
ARM: dts: Add PMU DT node for exynos5260 SoC
ARM: EXYNOS: Add support for Exynos5410 PMU
ARM: dts: Add PMU to exynos5410
...
152 lines
4.2 KiB
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152 lines
4.2 KiB
Plaintext
Device tree binding vendor prefix registry. Keep list in alphabetical order.
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This isn't an exhaustive list, but you should add new prefixes to it before
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using them to avoid name-space collisions.
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abilis Abilis Systems
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active-semi Active-Semi International Inc
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ad Avionic Design GmbH
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adapteva Adapteva, Inc.
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adi Analog Devices, Inc.
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aeroflexgaisler Aeroflex Gaisler AB
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ak Asahi Kasei Corp.
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allwinner Allwinner Technology Co., Ltd.
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altr Altera Corp.
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amcc Applied Micro Circuits Corporation (APM, formally AMCC)
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amd Advanced Micro Devices (AMD), Inc.
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ams AMS AG
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amstaos AMS-Taos Inc.
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apm Applied Micro Circuits Corporation (APM)
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arm ARM Ltd.
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armadeus ARMadeus Systems SARL
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atmel Atmel Corporation
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auo AU Optronics Corporation
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avago Avago Technologies
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bosch Bosch Sensortec GmbH
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brcm Broadcom Corporation
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buffalo Buffalo, Inc.
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calxeda Calxeda
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capella Capella Microsystems, Inc
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cavium Cavium, Inc.
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cdns Cadence Design Systems Inc.
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chrp Common Hardware Reference Platform
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chunghwa Chunghwa Picture Tubes Ltd.
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cirrus Cirrus Logic, Inc.
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cortina Cortina Systems, Inc.
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crystalfontz Crystalfontz America, Inc.
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dallas Maxim Integrated Products (formerly Dallas Semiconductor)
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davicom DAVICOM Semiconductor, Inc.
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denx Denx Software Engineering
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digi Digi International Inc.
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dlink D-Link Corporation
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dmo Data Modul AG
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ebv EBV Elektronik
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edt Emerging Display Technologies
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emmicro EM Microelectronic
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epcos EPCOS AG
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epfl Ecole Polytechnique Fédérale de Lausanne
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epson Seiko Epson Corp.
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est ESTeem Wireless Modems
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eukrea Eukréa Electromatique
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excito Excito
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fsl Freescale Semiconductor
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GEFanuc GE Fanuc Intelligent Platforms Embedded Systems, Inc.
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gef GE Fanuc Intelligent Platforms Embedded Systems, Inc.
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globalscale Globalscale Technologies, Inc.
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gmt Global Mixed-mode Technology, Inc.
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google Google, Inc.
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gumstix Gumstix, Inc.
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haoyu Haoyu Microelectronic Co. Ltd.
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hisilicon Hisilicon Limited.
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honeywell Honeywell
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hp Hewlett Packard
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i2se I2SE GmbH
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ibm International Business Machines (IBM)
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idt Integrated Device Technologies, Inc.
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iom Iomega Corporation
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img Imagination Technologies Ltd.
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intel Intel Corporation
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intercontrol Inter Control Group
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isee ISEE 2007 S.L.
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isl Intersil
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karo Ka-Ro electronics GmbH
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keymile Keymile GmbH
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lacie LaCie
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lantiq Lantiq Semiconductor
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lenovo Lenovo Group Ltd.
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lg LG Corporation
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linux Linux-specific binding
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lsi LSI Corp. (LSI Logic)
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lltc Linear Technology Corporation
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marvell Marvell Technology Group Ltd.
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maxim Maxim Integrated Products
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mediatek MediaTek Inc.
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micrel Micrel Inc.
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microchip Microchip Technology Inc.
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mosaixtech Mosaix Technologies, Inc.
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moxa Moxa
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mpl MPL AG
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mundoreader Mundo Reader S.L.
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murata Murata Manufacturing Co., Ltd.
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mxicy Macronix International Co., Ltd.
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national National Semiconductor
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neonode Neonode Inc.
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netgear NETGEAR
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newhaven Newhaven Display International
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nintendo Nintendo
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nokia Nokia
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nvidia NVIDIA
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nxp NXP Semiconductors
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onnn ON Semiconductor Corp.
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opencores OpenCores.org
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panasonic Panasonic Corporation
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phytec PHYTEC Messtechnik GmbH
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picochip Picochip Ltd
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plathome Plat'Home Co., Ltd.
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powervr PowerVR (deprecated, use img)
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qca Qualcomm Atheros, Inc.
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qcom Qualcomm Technologies, Inc
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qnap QNAP Systems, Inc.
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radxa Radxa
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raidsonic RaidSonic Technology GmbH
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ralink Mediatek/Ralink Technology Corp.
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ramtron Ramtron International
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realtek Realtek Semiconductor Corp.
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renesas Renesas Electronics Corporation
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ricoh Ricoh Co. Ltd.
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rockchip Fuzhou Rockchip Electronics Co., Ltd
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samsung Samsung Semiconductor
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sbs Smart Battery System
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schindler Schindler
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seagate Seagate Technology PLC
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sil Silicon Image
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silabs Silicon Laboratories
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simtek
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sii Seiko Instruments, Inc.
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sirf SiRF Technology, Inc.
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smsc Standard Microsystems Corporation
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snps Synopsys, Inc.
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solidrun SolidRun
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spansion Spansion Inc.
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st STMicroelectronics
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ste ST-Ericsson
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stericsson ST-Ericsson
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synology Synology, Inc.
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ti Texas Instruments
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tlm Trusted Logic Mobility
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toradex Toradex AG
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toshiba Toshiba Corporation
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toumaz Toumaz
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usi Universal Scientifc Industrial Co., Ltd.
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v3 V3 Semiconductor
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variscite Variscite Ltd.
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via VIA Technologies, Inc.
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voipac Voipac Technologies s.r.o.
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winbond Winbond Electronics corp.
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wlf Wolfson Microelectronics
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wm Wondermedia Technologies, Inc.
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xes Extreme Engineering Solutions (X-ES)
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xlnx Xilinx
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zyxel ZyXEL Communications Corp.
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zarlink Zarlink Semiconductor
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