Resolves a merge issue with:
drivers/tty/hvc/hvcs.c
and we want the tty/serial fixes from 5.12-rc3 in here as well.
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
i.Core MX8M Mini is an EDIMM SoM based on NXP i.MX8M Mini from Engicam.
EDIMM2.2 Starter Kit is an EDIMM 2.2 Form Factor Capacitive Evaluation
Board from Engicam.
i.Core MX8M Mini needs to mount on top of this Evaluation board for
creating complete i.Core MX8M Mini EDIMM2.2 Starter Kit.
Add bindings for it.
Signed-off-by: Jagan Teki <jagan@amarulasolutions.com>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
i.Core MX8M Mini is an EDIMM SoM based on NXP i.MX8M Mini from Engicam.
C.TOUCH 2.0 is a general purpose carrier board with capacitive
touch interface support.
i.Core MX8M Mini needs to mount on top of this Carrier board for
creating complete i.Core MX8M Mini C.TOUCH 2.0 board.
Add bindings for it.
Signed-off-by: Jagan Teki <jagan@amarulasolutions.com>
Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
Align with all other i.MX using the mmc controller, align
the clock-names.
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
I discovered that hardware actually supports two interrupts, one per DMA
channel (RX and TX).
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: David S. Miller <davem@davemloft.net>
The NT39016 panel is a fun beast, even though the documentation states
that the CS line is active-low, it will work just fine if the CS line is
configured as active-high, but it won't work if the CS line is forced
low or forced high.
Since it did actually work with the spi-cs-high property, this is not a
bugfix, but we should nonetheless remove that property from the example
to match the documentation.
Signed-off-by: Paul Cercueil <paul@crapouillou.net>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thomas Bogendoerfer <tsbogend@alpha.franken.de>
This patch updates the documentation for the CEVA controller for adding
the optional properties for 'phys' and 'resets'.
Signed-off-by: Piyush Mehta <piyush.mehta@xilinx.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Jens Axboe <axboe@kernel.dk>
Document the ipq6018-cp01 board. It was missing leading to warning:
arch/arm64/boot/dts/qcom/ipq6018-cp01-c1.dt.yaml: /: compatible: 'oneOf' conditional failed, one must be fixed:
['qcom,ipq6018-cp01', 'qcom,ipq6018'] is too short
['qcom,ipq6018-cp01', 'qcom,ipq6018'] is too long
Additional items are not allowed ('qcom,ipq6018' was unexpected)
Signed-off-by: Vinod Koul <vkoul@kernel.org>
Link: https://lore.kernel.org/r/20210308060826.3074234-4-vkoul@kernel.org
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
i.Core STM32MP1 is an EDIMM SoM based on STM32MP157A from Engicam.
EDIMM2.2 Starter Kit is an EDIMM 2.2 Form Factor Capacitive Evaluation
Board from Engicam.
i.Core STM32MP1 needs to mount on top of this Evaluation board for
creating complete i.Core STM32MP1 EDIMM2.2 Starter Kit.
Add bindings for it.
Signed-off-by: Jagan Teki <jagan@amarulasolutions.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Alexandre Torgue <alexandre.torgue@foss.st.com>
i.Core STM32MP1 is an EDIMM SoM based on STM32MP157A from Engicam.
C.TOUCH 2.0 is a general purpose carrier board with capacitive
touch interface support.
i.Core STM32MP1 needs to mount on top of this Carrier board for
creating complete i.Core STM32MP1 C.TOUCH 2.0 board.
Add bindings for it.
Signed-off-by: Jagan Teki <jagan@amarulasolutions.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Alexandre Torgue <alexandre.torgue@foss.st.com>
MicroGEA STM32MP1 is a STM32MP157A based Micro SoM.
MicroDev 2.0 is a general purpose miniature carrier board with CAN,
LTE and LVDS panel interfaces.
7" OF is a capacitive touch 7" Open Frame panel solutions.
MicroGEA STM32MP1 needs to mount on top of MicroDev 2.0 board with
pluged 7" OF for creating complete MicroGEA STM32MP1 MicroDev 2.0
7" Open Frame Solution board.
Add bindings for it.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Jagan Teki <jagan@amarulasolutions.com>
Signed-off-by: Alexandre Torgue <alexandre.torgue@foss.st.com>
MicroGEA STM32MP1 is a STM32MP157A based Micro SOM.
MicroDev 2.0 is a general purpose miniature carrier board with CAN,
LTE and LVDS panel interfaces.
MicroGEA STM32MP1 needs to mount on top of this MicroDev 2.0 board
for creating complete MicroGEA STM32MP1 MicroDev 2.0 Carrier board.
Add bindings for it.
Signed-off-by: Jagan Teki <jagan@amarulasolutions.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Alexandre Torgue <alexandre.torgue@foss.st.com>
Captured using a raw IR receiver. Manual linked in the remote definition
itself.
Signed-off-by: Bastien Nocera <hadess@hadess.net>
Signed-off-by: Sean Young <sean@mess.org>
Signed-off-by: Mauro Carvalho Chehab <mchehab+huawei@kernel.org>
Add a keymap and bindings for the simple IR (NEC) remote used with
Minix 'NEO' branded Android STB devices.
Signed-off-by: Christian Hewitt <christianshewitt@gmail.com>
Signed-off-by: Sean Young <sean@mess.org>
Signed-off-by: Mauro Carvalho Chehab <mchehab+huawei@kernel.org>
When adding support for V3U (r8a779a0) it was incorrectly recorded it
supports four nodes, while in fact it supports five. The fifth node is
named TSC0 and breaks the existing naming schema starting at 1. Work
around this by separately defining the reg property for V3U and others.
Restore the maximum number of nodes to three for other compatibles as
it was before erroneously increasing it for V3U.
Fixes: d7fdfb6541 ("dt-bindings: thermal: rcar-gen3-thermal: Add r8a779a0 support")
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210310110716.3297544-1-niklas.soderlund+renesas@ragnatech.se
SAMA7G5's I2S-MCC has 4 pairs of DIN/DOUT pins. Since TDM only uses a
single pair of pins for synchronous capture and playback, the controller
needs to be told which of the pair is connected. This can be mentioned
using the new "microchip,tdm-data-pair" property. The property is optional,
needed only if TDM is used, and if it's missing DIN/DOUT 0 pins will be
used by default.
Signed-off-by: Codrin Ciubotariu <codrin.ciubotariu@microchip.com>
Link: https://lore.kernel.org/r/20210301170905.835091-5-codrin.ciubotariu@microchip.com
Signed-off-by: Mark Brown <broonie@kernel.org>
