Most of the boards are using the TI AM/DM37x processor, there is only a small
quantity of IGEP Processor Boards based on TI OMAP3530. So it's better use the
omap36xx.dtsi include instead of omap34xx.dtsi include. We can add support
for the 34xx based variant later on as needed.
To avoid confusion we have added to the model the (TI AM/DM37x) comment.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[tony@atomide.com: updated comments for the 34xx to 36xx include change]
Signed-off-by: Tony Lindgren <tony@atomide.com>
The IGEP COM Module has an 512MB NAND flash memory.
Add a device node for this NAND and its partition layout.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
ISEE IGEP COM Module is an TI OMAP3 SoC computer on module.
This patch adds an initial device tree support to boot an
IGEP COM Module from the MMC/SD.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[b-cousson@ti.com: Update the Makefile for 3.8-rc2]
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
