Use the omap3-igep0030-common.dtsi file and remove repeated parts leaving
the nodes that are not common between IGEP COM MODULE hardware revisions.
Signed-off-by: Enric Balletbo i Serra <eballetbo@iseebcn.com>
Acked-by: Javier Martinez Canillas <javier@dowhile0.org>
Signed-off-by: Tony Lindgren <tony@atomide.com>
New IGEP boards revisions will use another Wifi module, so this patch moves
the DT nodes outside the common omap3-igep.dtsi file to specific DT for every
board.
Signed-off-by: Enric Balletbo i Serra <eballetbo@iseebcn.com>
Acked-by: Javier Martinez Canillas <javier@dowhile0.org>
Signed-off-by: Tony Lindgren <tony@atomide.com>
We'll introduce new hardware revisions soon. This patch is only to
indicate which board revision supports this device tree file in order
to avoid confusions.
Signed-off-by: Enric Balletbo i Serra <eballetbo@iseebcn.com>
Acked-by: Javier Martinez Canillas <javier@dowhile0.org>
Signed-off-by: Tony Lindgren <tony@atomide.com>
At this moment all supported boards use same NAND chip, so has more sense
move the GPMC and NAND configuration to the omap3-igep.dtsi common place.
Signed-off-by: Enric Balletbo i Serra <eballetbo@iseebcn.com>
Acked-by: Javier Martinez Canillas <javier@dowhile0.org>
Signed-off-by: Tony Lindgren <tony@atomide.com>
UART2 is used to connect the processor with the bluetooth chip, these pins
are not common between IGEPv2 boards and IGEP COM MODULE boards. This patch
muxes the correct pins for every board and removes UART2 configuration from
common omap3-igep.dtsi file.
Signed-off-by: Enric Balletbo i Serra <eballetbo@iseebcn.com>
Acked-by: Javier Martinez Canillas <javier@dowhile0.org>
Signed-off-by: Tony Lindgren <tony@atomide.com>
Looks like we have some GPMC NAND timings missing device
width. This fixes "gpmc_cs_program_settings: invalid width 0!"
errors during boot.
Signed-off-by: Tony Lindgren <tony@atomide.com>
The GPMC binding is obviously very confusing as the values
are all over the place. People seem to confuse the GPMC partition
size for the chip select, and the device IO size within the GPMC
partition easily.
The ranges entry contains the GPMC partition size. And the
reg entry contains the size of the IO registers of the
device connected to the GPMC.
Let's fix the issue according to the following table:
Device GPMC partition size Device IO size
connected in the ranges entry in the reg entry
NAND 0x01000000 (16MB) 4
16550 0x01000000 (16MB) 8
smc91x 0x01000000 (16MB) 0xf
smc911x 0x01000000 (16MB) 0xff
OneNAND 0x01000000 (16MB) 0x20000 (128KB)
16MB NOR 0x01000000 (16MB) 0x01000000 (16MB)
32MB NOR 0x02000000 (32MB) 0x02000000 (32MB)
64MB NOR 0x04000000 (64MB) 0x04000000 (64MB)
128MB NOR 0x08000000 (128MB) 0x08000000 (128MB)
256MB NOR 0x10000000 (256MB) 0x10000000 (256MB)
Let's also add comments to the fixed entries while at it.
Acked-by: Roger Quadros <rogerq@ti.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
This patch is based on commit:
016c12d2 ("ARM: OMAP3: Fix hardware detection for omap3630 when booted with device tree")
and fixes a boot hang due the IGEP board being wrongly initialized
as an OMAP3430 platform instead of an OMAP3630.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Signed-off-by: Tony Lindgren <tony@atomide.com>
The omap3_pmx_core pinmux device in the device tree handles the system
controller module (SCM) PADCONFS fonction. Its control registers are
split in two distinct areas, with other SCM registers in-between. Those
other registers can't thus be requested by other drivers as the memory
region gets reserved by the pinmux driver.
Split the omap3_pmx_core device tree node in two for the two memory
regions. The second region address and size depends on the SoC model.
The change in omap3.dtsi fixes an "external abort on non-linefetch" when
doing
cat /sys/kernel/debug/pinctrl/.../pins
on a Nokia N900.
Note that the core2 padconf region is different for 3430 vs 3630,
and does not exist on 3517 as noted by Nishanth Menon <nm@ti.com>.
Reported-by: Tomi Valkeinen <tomi.valkeinen@ti.com>
Signed-off-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Acked-By: Sebastian Reichel <sre@debian.org>
Signed-off-by: Nishanth Menon <nm@ti.com>
[tony@atomide.com: updated for 3430 vs 3630 core2 based on Nishant's patch]
Signed-off-by: Tony Lindgren <tony@atomide.com>
Most of the boards are using the TI AM/DM37x processor, there is only a small
quantity of IGEP Processor Boards based on TI OMAP3530. So it's better use the
omap36xx.dtsi include instead of omap34xx.dtsi include. We can add support
for the 34xx based variant later on as needed.
To avoid confusion we have added to the model the (TI AM/DM37x) comment.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[tony@atomide.com: updated comments for the 34xx to 36xx include change]
Signed-off-by: Tony Lindgren <tony@atomide.com>
The IGEP COM MOdule has a GPIO LED connected to OMAP
pins. Configure this pin as output GPIO.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@iseebcn.com>
Signed-off-by: Benoit Cousson <bcousson@baylibre.com>
Use standard GPIO constants to enhance the readability of DT GPIOs.
Signed-off-by: Florian Vaussard <florian.vaussard@epfl.ch>
Acked-by: Santosh Shilimkar <santosh.shilimkar@ti.com>
Reviewed-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
Replace /include/ by #include for OMAP2+ DT, in order to use the
C pre-processor, making use of #define features possible.
Signed-off-by: Florian Vaussard <florian.vaussard@epfl.ch>
Acked-by: Santosh Shilimkar <santosh.shilimkar@ti.com>
Reviewed-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
The IGEP COM Module has an 512MB NAND flash memory.
Add a device node for this NAND and its partition layout.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
ISEE IGEP COM Module is an TI OMAP3 SoC computer on module.
This patch adds an initial device tree support to boot an
IGEP COM Module from the MMC/SD.
Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com>
[b-cousson@ti.com: Update the Makefile for 3.8-rc2]
Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org>
