Before, BUSIF which is needed for DMA transfer was automatically handled
via SSI, but it cared BUSIF0 only.
Now, rsnd driver can handle BUSIF0-7 (= for Gen3) BUSIF0-3 (= for Gen2)
via SSIU, and it is keeping compatibility.
Thus, BUSIF0 settings via SSI had been kept to avoid git merge timing
issue / git bisect issue, but it is no longer needed.
This patch removes it.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
KingFisher has pcm3168 sound codec. This patch enables it.
Because pcm3168 can't handle symmetric channel on playback/
capture, we need to handle it as different DAI.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
ULCB can use daughter board which is called as KingFisher.
It has extra sound interface, thus we want to use it.
But, basically, ALSA SoC can't use Multiple sound card with single
CPU sound interface (= SSI). Thus we need to use Single Sound Card
with multiple DAI interface.
To be easy to expand ULCB sound card on KingFisher, it is better to
use multi-dai-link style sound card on ULCB sound DT.
Now, "simple-audio-card" / "audio-graph-card" both can support
multi-dai-link style, but HDMI sound support (which is not yet supported
on ULCB) needs "audio-graph-card".
Using audio-graph-card is better selection.
This patch exchange current sound card to use it.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
As of commit 6d2ca85279 ("dt-bindings: display: renesas: Deprecate
LVDS support in the DU bindings"), the internal LVDS encoder has DT
bindings separate from the DU. The device trees for all R-Car H3 and
M3-W development boards were ported over to the new model, but
Salvator-XS boards equipped with an R-Car M3-W SoC were forgotten.
Fixes: 58e8ed2ee9 ("arm64: dts: renesas: Convert to new LVDS DT bindings")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Move the i2c nodes so that sub-nodes of the soc node are sorted by bus
address.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Move the pciec0 node so that sub-nodes of the soc node are
sorted by bus address.
This change has no run-time affect.
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
The RZ/G2E (a.k.a. R8A774C0) has one RGB output and two LVDS
outputs connected to DU.
This patch add support for DU, LVDS encoders, VSP and FCP.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add a device node for the second Cortex-A53 CPU core on the Renesas
RZ/G2E (a.k.a r8a774c0) SoC, and adjust the interrupt delivery masks
for the ARM Generic Interrupt Controller and Architectured Timer.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Add the device nodes for all RZ/G2E SCIF and HSCIF serial ports,
including clocks, power domains and DMAs.
According to the HW user manual, SCIF[015] and HSCIF[012] are
connected to both SYS-DMAC1 and SYS-DMAC2, while SCIF[34] and
HSCIF[34] are connected to SYS-DMAC0.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
According to the R-Car Gen3 Hardware Manual Errata for Rev 1.00 of
August 24, 2018, the TX clock internal delay mode doesn't support
on R-Car E3. This patch fixes EthernetAVB phy mode to rgmii.
This is achieved by simply dropping the phy-mode property from
r8a77990-ebisu.dts as the default property for this for r8a77990,
as set in r8a77990.dtsi, is "rgmii".
Signed-off-by: Kazuya Mizuguchi <kazuya.mizuguchi.ks@renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Ulrich Hecht <uli+renesas@fpond.eu>
SCIF2 on R-Car M3-N can be used with both DMAC1 and DMAC2.
Fixes: 0ea5b2fd38 ("arm64: dts: renesas: r8a77965: Add SCIF device nodes")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
SCIF2 on RZ/G2M can be used with both DMAC1 and DMAC2.
Fixes: 3a3933a4fa ("arm64: dts: renesas: r8a774a1: Add SCIF and HSCIF nodes")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The backlight levels provided in the Draak DT produce a perceived
brightness very biased towards high brightness. Use better brightness
levels based on the CIE 1931 formula.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: Ulrich Hecht <uli+renesas@fpond.eu>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Pull ARM Device-tree updates from Olof Johansson:
"As usual, this is where the bulk of our changes end up landing each
merge window.
The individual updates are too many to enumerate, many many platforms
have seen additions of device descriptions such that they are
functionally more complete (in fact, this is often the bulk of updates
we see).
Instead I've mostly focused on highlighting the new platforms below as
they are introduced. Sometimes the introduction is of mostly a
fragment, that later gets filled in on later releases, and in some
cases it's near-complete platform support. The latter is more common
for derivative platforms that already has similar support in-tree.
Two SoCs are slight outliers from the usual range of additions.
Allwinner support for F1C100s, a quite old SoC (ARMv5-based) shipping
in the Lychee Pi Nano platform. At the other end is NXP Layerscape
LX2160A, a 16-core 2.2GHz Cortex-A72 SoC with a large amount of I/O
aimed at infrastructure/networking.
TI updates stick out in the diff stats too, in particular because they
have moved the description of their L4 on-chip interconnect to
devicetree, which opens up for removal of even more of their
platform-specific 'hwmod' description tables over the next few
releases.
SoCs:
- Qualcomm QCS404 (4x Cortex-A53)
- Allwinner T3 (rebranded R40) and f1c100s (armv5)
- NXP i.MX7ULP (1x Cortex-A7 + 1x Cortex-M4)
- NXP LS1028A (2x Cortex-A72), LX2160A (16x Cortex-A72)
New platforms:
- Rockchip: Gru Scarlet (RK3188 Tablet)
- Amlogic: Phicomm N1 (S905D), Libretech S805-AC
- Broadcom: Linksys EA6500 v2 Wi-Fi router (BCM4708)
- Qualcomm: QCS404 base platform and EVB
- Qualcomm: Remove of Arrow SD600
- PXA: First PXA3xx DT board: Raumfeld
- Aspeed: Facebook Backpack-CMM BMC
- Renesas iWave G20D-Q7 (RZ/G1N)
- Allwinner t3-cqa3t-bv3 (T3/R40) and Lichee Pi Nano (F1C100s)
- Allwinner Emlid Neutis N5, Mapleboard MP130
- Marvell Macchiatobin Single Shot (Armada 8040, no 10GbE)
- i.MX: mtrion emCON-MX6, imx6ul-pico-pi, imx7d-sdb-reva
- VF610: Liebherr's BK4 device, ZII SCU4 AIB board
- i.MX7D PICO Hobbit baseboard
- i.MX7ULP EVK board
- NXP LX2160AQDS and LX2160ARDB boards
Other:
- Coresight binding updates across the board
- CPU cooling maps updates across the board"
* tag 'armsoc-dt' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (648 commits)
ARM: dts: suniv: Fix improper bindings include patch
ARM: dts: sunxi: Enable Broadcom-based Bluetooth for multiple boards
arm64: dts: allwinner: a64: bananapi-m64: Add Bluetooth device node
ARM: dts: suniv: Fix improper bindings include patch
arm64: dts: Add spi-[tx/rx]-bus-width for the FSL QSPI controller
arm64: dts: Remove unused properties from FSL QSPI driver nodes
ARM: dts: Add spi-[tx/rx]-bus-width for the FSL QSPI controller
ARM: dts: imx6sx-sdb: Fix the reg properties for the FSL QSPI nodes
ARM: dts: Remove unused properties from FSL QSPI driver nodes
arm64: dts: ti: k3-am654: Enable main domain McSPI0
arm64: dts: ti: k3-am654: Add McSPI DT nodes
arm64: dts: ti: k3-am654: Populate power-domain property for UART nodes
arm64: dts: ti: k3-am654-base-board: Enable ECAP PWM
arm64: dts: ti: k3-am65-main: Add ECAP PWM node
arm64: dts: ti: k3-am654-base-board: Add I2C nodes
arm64: dts: ti: am654-base-board: Add pinmux for main uart0
arm64: dts: ti: k3-am65: Add pinctrl regions
dt-bindings: pinctrl: k3: Introduce pinmux definitions
ARM: dts: exynos: Specify I2S assigned clocks in proper node
ARM: dts: exynos: Add missing CPUs in cooling maps for Odroid X2
...
While commit 3b7e7848f0 ("arm64: dts: renesas: r8a7795: Add IPMMU
device nodes") for R-Car H3 ES2.0 did include power-domains properties,
they were forgotten in the counterpart for older R-Car H3 ES1.x SoCs.
Fixes: e4b9a493df ("arm64: dts: renesas: r8a7795-es1: Add IPMMU device nodes")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The R-Car Gen3 HardWare Manual Errata for Rev. 1.00 (Aug 24, 2018)
removed the IPMMU-IR IOMMU instance on R-Car M3-N, as this SoC does not
have an Image Processing Unit (IMP-X5) nor the A3IR power domain.
Fixes: 55697cbb44 ("arm64: dts: renesas: r8a779{65,80,90}: Add IPMMU devices nodes")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Each CPU can (and does) participate in cooling down the system but the
DT only captures a handful of them, normally CPU0, in the cooling maps.
Things work by chance currently as under normal circumstances its the
first CPU of each cluster which is used by the operating systems to
probe the cooling devices. But as soon as this CPU ordering changes and
any other CPU is used to bring up the cooling device, we will start
seeing failures.
Also the DT is rather incomplete when we list only one CPU in the
cooling maps, as the hardware doesn't have any such limitations.
Update cooling maps to include all devices affected by individual trip
points.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
