This patch enables TI HD3SS3220 device and support usb role switch
for the CAT 874 platform.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The HiHope RZ/G2M sub board sits below the HiHope RZ/G2M main board.
This patch also adds ethernet support along with a dtsi common to
both HiHope RZ/G2M and RZ/G2N sub boards.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Basic support for the HiHope RZ/G2M main board:
- Memory,
- Main crystal,
- Serial console
This patch also includes a dtsi common to both HiHope RZ/G2M
and RZ/G2N main boards.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The RZ/G2M (a.k.a. r8a774a1) comes with two clusters of
processors, similarly to the r8a7796.
The first cluster is made of A57s, the second cluster is
made of A53s.
The operating points for the cluster with the A57s are:
Frequency | Voltage
-----------|---------
500 MHz | 0.82V
1.0 GHz | 0.82V
1.5 GHz | 0.82V
The operating points for the cluster with the A53s are:
Frequency | Voltage
-----------|---------
800 MHz | 0.82V
1.0 GHz | 0.82V
1.2 GHz | 0.82V
This patch adds the definitions for the operating points
to the SoC specific DT.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Chris Paterson <Chris.Paterson2@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
A single cooling device is described for all A53 CPUs as this
reflects that physically there is only one cooling device present.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
The A57 cooling device supports 5 cooling states which can be categorised
as follows:
0 & 1) boost (clocking up)
2) default
3 & 4) cooling (clocking down)
Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.
A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Using cooling-device indexes such that maximum refers to maximum cooling
rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
The A57 cooling device supports 5 cooling states which can be categorised
as follows:
0 & 1) boost (clocking up)
2) default
3 & 4) cooling (clocking down)
Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.
A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Using cooling-device indexes such that maximum refers to maximum cooling
rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: Hien Dang <hien.dang.eb@rvc.renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.
In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
Currently, IPA controls base on only CPU temperature.
And only one thermal channel is assembled closest
CPU cores is selected as target of IPA.
If other channels are used, IPA controlling is not properly.
The A5 cooling device supports 5 cooling states which can be categorised as
follows:
0 & 1) boost (clocking up)
2) default
3 & 4) cooling (clocking down)
Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.
A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.
This patch improves on an earlier version by:
* Omitting cooling-max-level and cooling-min-level properties which
are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
property.
* Using cooling-device indexes such that maximum refers to maximum cooling
rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
these are properties of the CPU.
The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: Keita Kobayashi <keita.kobayashi.ym@renesas.com>
Signed-off-by: Gaku Inami <gaku.inami.xw@bp.renesas.com>
Signed-off-by: Hien Dang <hien.dang.eb@rvc.renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Since the commit 233da2c9ec ("dt-bindings: phy: rcar-gen3-phy-usb2:
Revise #phy-cells property") revised the #phy-cells, this patch follows
the updated document for R-Car Gen3 and RZ/A2 SoCs.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
It is incorrect to specify the no-ether-link property for the AVB device on
the Ebisu board. This is because the property should only be used when a
board does not provide a proper AVB_LINK signal. However, the Ebisu board
does provide this signal.
As per 87c059e9c3 ("arm64: dts: renesas: salvator-x: Remove renesas,
no-ether-link property") this fixes a bug:
Steps to reproduce:
- start AVB TX stream (Using aplay via MSE),
- disconnect+reconnect the eth cable,
- after a reconnection the eth connection goes iteratively up/down
without user interaction,
- this may heal after some seconds or even stay for minutes.
As the documentation specifies, the "renesas,no-ether-link" option
should be used when a board does not provide a proper AVB_LINK signal.
There is no need for this option enabled on RCAR H3/M3 Salvator-X/XS
and ULCB starter kits since the AVB_LINK is correctly handled by HW.
Choosing to keep or remove the "renesas,no-ether-link" option will have
impact on the code flow in the following ways:
- keeping this option enabled may lead to unexpected behavior since the
RX & TX are enabled/disabled directly from adjust_link function
without any HW interrogation,
- removing this option, the RX & TX will only be enabled/disabled after
HW interrogation. The HW check is made through the LMON pin in PSR
register which specifies AVB_LINK signal value (0 - at low level;
1 - at high level).
In conclusion, the present change is also a safety improvement because
it removes the "renesas,no-ether-link" option leading to a proper way
of detecting the link state based on HW interrogation and not on
software heuristic.
Fixes: 8441ef643d ("arm64: dts: renesas: r8a77990: ebisu: Enable EthernetAVB")
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
[simon: updated changelog]
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Apparently this DTS crossed over with commit 31af04cd60 ("arm64: dts:
Remove inconsistent use of 'arm,armv8' compatible string") and missed
out on the cleanup, so put it right.
Signed-off-by: Robin Murphy <robin.murphy@arm.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
This patch adds description of TI WL1837 and links interfaces
to communicate with the IC, namely the SDIO interface to WLAN.
Signed-off-by: Spyridon Papageorgiou <spapageorgiou@de.adit-jv.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The ports node of vin4 only has one sub-node and thus does
not need #address-cells/#size-cells and the sub-node does
not need an exit.
This addresses the following warning:
# make dtbs W=1
...
arch/arm64/boot/dts/renesas/r8a77995-draak.dts:492.8-503.4: Warning (graph_child_address): /soc/video@e6ef4000/ports: graph node has single child node 'port@0', #address-cells/#size-cells are not necessary
Fixes: 6a0942c20f ("arm64: dts: renesas: draak: Describe CVBS input")
Cc: Jacopo Mondi <jacopo+renesas@jmondi.org>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Tested-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
The CAT874 board pushes sound via I2S over SSI0 into the
TDA19988BET chip.
This commit wires things up so that we can get sound out of
the HDMI interface.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The CAT874 board comes with a HDMI connector, managed by
a TDA19988BET chip, connected to the RZ/G2E SoC via DPAD.
This patch adds the necessary support to the board DT.
Signed-off-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Hook up r8a774a1 DMAC nodes to the IPMMUs. In particular SYS-DMAC0
gets tied to IPMMU-DS0, and SYS-DMAC1 and SYS-DMAC2 get tied to IPMMU-DS1.
Based on work for the r8a7796 by Magnus Damm.
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Remove the "reg-names" property from the display node of R-Car Gen3 R8A77965
device tree.
No other mainline R-Car Gen3 SoC has that property specified.
Fixes: 2f2c71bfc8 ("arm64: dts: renesas: r8a77965: Populate the DU instance placeholder")
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
[reworded commit message, sent upstream]
Signed-off-by: Jacopo Mondi <jacopo+renesas@jmondi.org>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
The Salvator-X and XS boards have a 4 lines DIP switch and 3 push
buttons connected to SoC GPIOs, meant to be used as general-purpose test
keys. Add a corresponding node in DT, mapping (semi-randomly) the DIP
switch to keys 1-4 and the push buttons to keys A-C.
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Basic audio dmac register only supports busif from 0 to 3,
in order to use busif4 ~ busif7, extended audio dmac register
need to be used.
This patch updates H3 (= r8a7795), M3-W (= r8a7796) and
M3-N (=r8a77965) to use extended audio dmac register set.
Signed-off-by: Jiada Wang <jiada_wang@mentor.com>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
