linux/Documentation/devicetree/bindings/vendor-prefixes.txt
Linus Torvalds 463311960e USB patches for 3.18-rc1
Here's the big USB patchset for 3.18-rc1.  Also in here is the PHY tree,
 as it seems to fit well with the USB tree for various reasons...
 
 Anyway, lots of little changes in here, all over the place, full details
 in the changelog below.
 
 All have been in the linux-next tree for a while with no issues.
 
 Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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Merge tag 'usb-3.18-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/usb

Pull USB updates from Greg KH:
 "Here's the big USB patchset for 3.18-rc1.  Also in here is the PHY
  tree, as it seems to fit well with the USB tree for various reasons...

  Anyway, lots of little changes in here, all over the place, full
  details in the changelog

  All have been in the linux-next tree for a while with no issues"

* tag 'usb-3.18-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/usb: (244 commits)
  USB: host: st: fix typo 'CONFIG_USB_EHCI_HCD_ST'
  uas: Reduce number of function arguments for uas_alloc_foo functions
  xhci: Allow xHCI drivers to be built as separate modules
  xhci: Export symbols used by host-controller drivers
  xhci: Check for XHCI_COMP_MODE_QUIRK when disabling D3cold
  xhci: Introduce xhci_init_driver()
  usb: hcd: add generic PHY support
  usb: rename phy to usb_phy in HCD
  usb: gadget: uvc: fix up uvcg_v4l2_get_unmapped_area typo
  USB: host: st: fix ehci/ohci driver selection
  usb: host: ehci-exynos: Remove unnecessary usb-phy support
  usb: core: return -ENOTSUPP for all targeted hosts
  USB: Remove .owner field for driver
  usb: core: log higher level message on malformed LANGID descriptor
  usb: Add LED triggers for USB activity
  usb: Rename usb-common.c
  usb: gadget: Refactor request completion
  usb: gadget: Introduce usb_gadget_giveback_request()
  usb: dwc2/gadget: move phy bus legth initialization
  phy: remove .owner field for drivers using module_platform_driver
  ...
2014-10-08 06:47:31 -04:00

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Device tree binding vendor prefix registry. Keep list in alphabetical order.
This isn't an exhaustive list, but you should add new prefixes to it before
using them to avoid name-space collisions.
abilis Abilis Systems
active-semi Active-Semi International Inc
ad Avionic Design GmbH
adapteva Adapteva, Inc.
adi Analog Devices, Inc.
aeroflexgaisler Aeroflex Gaisler AB
ak Asahi Kasei Corp.
allwinner Allwinner Technology Co., Ltd.
altr Altera Corp.
amcc Applied Micro Circuits Corporation (APM, formally AMCC)
amd Advanced Micro Devices (AMD), Inc.
ams AMS AG
amstaos AMS-Taos Inc.
apm Applied Micro Circuits Corporation (APM)
arm ARM Ltd.
armadeus ARMadeus Systems SARL
atmel Atmel Corporation
auo AU Optronics Corporation
avago Avago Technologies
bosch Bosch Sensortec GmbH
brcm Broadcom Corporation
buffalo Buffalo, Inc.
calxeda Calxeda
capella Capella Microsystems, Inc
cavium Cavium, Inc.
cdns Cadence Design Systems Inc.
chipidea Chipidea, Inc
chrp Common Hardware Reference Platform
chunghwa Chunghwa Picture Tubes Ltd.
cirrus Cirrus Logic, Inc.
cortina Cortina Systems, Inc.
crystalfontz Crystalfontz America, Inc.
dallas Maxim Integrated Products (formerly Dallas Semiconductor)
davicom DAVICOM Semiconductor, Inc.
denx Denx Software Engineering
digi Digi International Inc.
dlink D-Link Corporation
dmo Data Modul AG
ebv EBV Elektronik
edt Emerging Display Technologies
emmicro EM Microelectronic
epcos EPCOS AG
epfl Ecole Polytechnique Fédérale de Lausanne
epson Seiko Epson Corp.
est ESTeem Wireless Modems
eukrea Eukréa Electromatique
excito Excito
fcs Fairchild Semiconductor
fsl Freescale Semiconductor
GEFanuc GE Fanuc Intelligent Platforms Embedded Systems, Inc.
gef GE Fanuc Intelligent Platforms Embedded Systems, Inc.
globalscale Globalscale Technologies, Inc.
gmt Global Mixed-mode Technology, Inc.
google Google, Inc.
gumstix Gumstix, Inc.
haoyu Haoyu Microelectronic Co. Ltd.
hisilicon Hisilicon Limited.
honeywell Honeywell
hp Hewlett Packard
i2se I2SE GmbH
ibm International Business Machines (IBM)
idt Integrated Device Technologies, Inc.
iom Iomega Corporation
img Imagination Technologies Ltd.
intel Intel Corporation
intercontrol Inter Control Group
isee ISEE 2007 S.L.
isl Intersil
karo Ka-Ro electronics GmbH
keymile Keymile GmbH
lacie LaCie
lantiq Lantiq Semiconductor
lenovo Lenovo Group Ltd.
lg LG Corporation
linux Linux-specific binding
lsi LSI Corp. (LSI Logic)
lltc Linear Technology Corporation
marvell Marvell Technology Group Ltd.
maxim Maxim Integrated Products
mediatek MediaTek Inc.
micrel Micrel Inc.
microchip Microchip Technology Inc.
mosaixtech Mosaix Technologies, Inc.
moxa Moxa
mpl MPL AG
mundoreader Mundo Reader S.L.
murata Murata Manufacturing Co., Ltd.
mxicy Macronix International Co., Ltd.
national National Semiconductor
neonode Neonode Inc.
netgear NETGEAR
newhaven Newhaven Display International
nintendo Nintendo
nokia Nokia
nvidia NVIDIA
nxp NXP Semiconductors
onnn ON Semiconductor Corp.
opencores OpenCores.org
panasonic Panasonic Corporation
phytec PHYTEC Messtechnik GmbH
picochip Picochip Ltd
plathome Plat'Home Co., Ltd.
pixcir PIXCIR MICROELECTRONICS Co., Ltd
powervr PowerVR (deprecated, use img)
qca Qualcomm Atheros, Inc.
qcom Qualcomm Technologies, Inc
qnap QNAP Systems, Inc.
radxa Radxa
raidsonic RaidSonic Technology GmbH
ralink Mediatek/Ralink Technology Corp.
ramtron Ramtron International
realtek Realtek Semiconductor Corp.
renesas Renesas Electronics Corporation
ricoh Ricoh Co. Ltd.
rockchip Fuzhou Rockchip Electronics Co., Ltd
samsung Samsung Semiconductor
sbs Smart Battery System
schindler Schindler
seagate Seagate Technology PLC
sil Silicon Image
silabs Silicon Laboratories
simtek
sii Seiko Instruments, Inc.
silergy Silergy Corp.
sirf SiRF Technology, Inc.
smsc Standard Microsystems Corporation
snps Synopsys, Inc.
solidrun SolidRun
spansion Spansion Inc.
st STMicroelectronics
ste ST-Ericsson
stericsson ST-Ericsson
synology Synology, Inc.
ti Texas Instruments
tlm Trusted Logic Mobility
toradex Toradex AG
toshiba Toshiba Corporation
toumaz Toumaz
usi Universal Scientific Industrial Co., Ltd.
v3 V3 Semiconductor
variscite Variscite Ltd.
via VIA Technologies, Inc.
voipac Voipac Technologies s.r.o.
winbond Winbond Electronics corp.
wlf Wolfson Microelectronics
wm Wondermedia Technologies, Inc.
xes Extreme Engineering Solutions (X-ES)
xlnx Xilinx
zyxel ZyXEL Communications Corp.
zarlink Zarlink Semiconductor