Commit Graph

81 Commits

Author SHA1 Message Date
David Rientjes
dd8e8c4a2c thermal, cpufreq: Fix build when CPU_FREQ_TABLE isn't configured
Commit 0236141837 ("thermal: add generic cpufreq cooling
implementation") requires cpufreq_frequency_get_table(), but that
function is only defined for CONFIG_CPU_FREQ_TABLE resulting in the
following build error:

  drivers/built-in.o: In function `cpufreq_get_max_state':
  drivers/thermal/cpu_cooling.c:259: undefined reference to `cpufreq_frequency_get_table'
  drivers/built-in.o: In function `get_cpu_frequency':
  drivers/thermal/cpu_cooling.c:129: undefined reference to `cpufreq_frequency_get_table'

Fix it by selecting CONFIG_CPU_FREQ_TABLE for such a configuration.

It turns out CONFIG_EXYNOS_THERMAL also needs CONFIG_CPU_FREQ_TABLE, so
select it there as well.

Signed-off-by: David Rientjes <rientjes@google.com>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2012-10-15 14:00:07 -07:00
Len Brown
29b19e2504 Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermal
Conflicts:
	drivers/staging/omap-thermal/omap-thermal-common.
		OMAP supplied dummy TC1 and TC2,
		at the same time that the thermal tree removed them
		from thermal_zone_device_register()

	drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
		propogate the upstream MAX_IDR_LEVEL re-name
			to prevent a build failure

	Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au>

Signed-off-by: Len Brown <len.brown@intel.com>
2012-10-09 01:35:52 -04:00
Fengguang Wu
125c4c706b idr: rename MAX_LEVEL to MAX_IDR_LEVEL
To avoid name conflicts:

  drivers/video/riva/fbdev.c:281:9: sparse: preprocessor token MAX_LEVEL redefined

While at it, also make the other names more consistent and add
parentheses.

[akpm@linux-foundation.org: repair fallout]
[sfr@canb.auug.org.au: IB/mlx4: fix for MAX_ID_MASK to MAX_IDR_MASK name change]
Signed-off-by: Fengguang Wu <fengguang.wu@intel.com>
Cc: Bernd Petrovitsch <bernd@petrovitsch.priv.at>
Cc: walter harms <wharms@bfs.de>
Cc: Glauber Costa <glommer@parallels.com>
Signed-off-by: Stephen Rothwell <sfr@canb.auug.org.au>
Cc: Roland Dreier <roland@purestorage.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2012-10-06 03:04:56 +09:00
Sachin Kamat
c072fed95c thermal: Exynos: Fix NULL pointer dereference in exynos_unregister_thermal()
exynos_unregister_thermal() is functional only when 'th_zone' is not
NULL (ensured by the NULL checks). However, in the event it is NULL, it
gets dereferenced in the for loop. This patch fixes this issue.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
2012-09-28 08:23:21 +08:00
Jonghwa Lee
a4b6fec977 Thermal: Fix bug on cpu_cooling, cooling device's id conflict problem.
This patch fixes small bug on cpu_cooling. CPU cooling device has own
id generated with idr mathod. However in the previous version, it swapped
to all same id at last stage of probing as 0. This makes id's collision and
also occures error when it releases that id.

Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
2012-09-27 14:11:22 +08:00
Amit Daniel Kachhap
79e093c3fe thermal: exynos: Use devm_* functions
devm_* functions are used to replace kzalloc, request_mem_region, ioremap
and request_irq functions in probe call. With the usage of devm_* functions
explicit freeing and unmapping is not required.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Sachin Kamat <sachin.kamat@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap
17be868e04 ARM: exynos: add thermal sensor driver platform data support
Add necessary default platform data support needed for TMU driver.  The
supplied dt/non-dt values are tested for origen exynos4210 and smdk exynos5250
platforms and only compile tested for exynos4412.

Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: jonghwa lee <jonghwa3.lee@samsung.com>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap
7e0b55e606 thermal: exynos: register the tmu sensor with the kernel thermal layer
This code added creates a link between temperature sensors, linux thermal
framework and cooling devices for samsung exynos platform.  This layer
monitors the temperature from the sensor and informs the generic thermal
layer to take the necessary cooling action.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap
f22d9c03cc thermal: exynos5: add exynos5250 thermal sensor driver support
Insert exynos5 TMU sensor changes into the thermal driver.  Some exynos4
changes are made generic for exynos series.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: SangWook Ju <sw.ju@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap
c48cbba6fe hwmon: exynos4: move thermal sensor driver to driver/thermal directory
This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c.  The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.

Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap
0236141837 thermal: add generic cpufreq cooling implementation
This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms.  As a proof of concept, we have
drivers for the following platforms using this mechanism now:

 * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
 * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)

There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.

Brief Description:

1) The generic cooling devices code is placed inside driver/thermal/*
   as placing inside acpi folder will need un-necessary enabling of acpi
   code.  This code is architecture independent.

2) This patchset adds generic cpu cooling low level implementation
   through frequency clipping.  In future, other cpu related cooling
   devices may be added here.  An ACPI version of this already exists
   (drivers/acpi/processor_thermal.c) .But this will be useful for
   platforms like ARM using the generic thermal interface along with the
   generic cpu cooling devices.  The cooling device registration API's
   return cooling device pointers which can be easily binded with the
   thermal zone trip points.  The important APIs exposed are,

   a) struct thermal_cooling_device *cpufreq_cooling_register(
        struct cpumask *clip_cpus)
   b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

3) Samsung exynos platform thermal implementation is done using the
   generic cpu cooling APIs and the new trip type.  The temperature sensor
   driver present in the hwmon folder(registered as hwmon driver) is moved
   to thermal folder and registered as a thermal driver.

A simple data/control flow diagrams is shown below,

Core Linux thermal <----->  Exynos thermal interface <----- Temperature Sensor
          |                             |
         \|/                            |
  Cpufreq cooling device <---------------

TODO:
*Will send the DT enablement patches later after the driver is merged.

This patch:

Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Guenter Roeck
204dd1d39c thermal: Fix potential NULL pointer accesses
The type parameter in thermal_zone_device_register and
thermal_cooling_device_register can be NULL, indicating that no sysfs attribute
for the type should be created. Only call strlen() and strcpy() on type if it is
not NULL.

This patch addresses Coverity #102180 and #102182: Dereference before null check

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Kuninori Morimoto
1e426ffddf thermal: add Renesas R-Car thermal sensor support
This patch add basic Renesas R-Car thermal sensor support.
It was tested on R-Car H1 Marzen board.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Cc: Len Brown <len.brown@intel.com>
Cc: Joe Perches <joe@perches.com>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Magnus Damm <magnus.damm@gmail.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:37 +08:00
Guenter Roeck
79a49168b5 thermal: fix potential out-of-bounds memory access
temp_crit.name and temp_input.name have a length of 16 bytes.  Using
THERMAL_NAME_LENGTH (20) as length parameter for snprintf() may result in
out-of-bounds memory accesses.  Replace it with sizeof().

Addresses Coverity #115679

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Cc: Len Brown <lenb@kernel.org>
Cc: "Brown, Len" <len.brown@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:37 +08:00
Zhang Rui
f4a821ce6e Thermal: Introduce locking for cdev.thermal_instances list.
we need to go over all the thermal_instance list of a cooling device
to decide which cooling state to put the cooling device to.

But at this time, as a cooling device may be referenced in multiple
thermal zones, we need to lock the list first in case
another thermal zone is updating this cooling device.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui
908b9fb792 Thermal: Unify the code for both active and passive cooling
Remove thermal_zone_device_passive(). And use
thermal_zone_trip_update() and thermal_zone_do_update()
for both active and passive cooling.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui
ce119f8325 Thermal: Introduce simple arbitrator for setting device cooling state
This fixes the problem that a cooling device may be referenced by
by multiple trip points in multiple thermal zones.

With this patch, we have two stages for updating a thermal zone,
1. check if a thermal_instance needs to be updated or not
2. update the cooling device, based on the target cooling state
   of all its instances.

Note that, currently, the cooling device is set to the deepest
cooling state required.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui
b5e4ae620b Thermal: List thermal_instance in thermal_cooling_device.
List thermal_instance in thermal_cooling_device so that
cooling device can know the cooling state requirement
of all the thermal instances.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui
cddf31b3b2 Thermal: Rename thermal_instance.node to thermal_instance.tz_node.
thermal_instance should be referenced by both thermal zone devices
and thermal cooling devices.

Rename thermal_instance.node to thermal_instance.tz_node in this patch
and thermal_instanace.cdev_node will be introduced in next patch.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui
2d374139d5 Thermal: Rename thermal_zone_device.cooling_devices
Rename thermal_zone_device.cooling_devices
to thermal_zone_device.thermal_instances

thermal_zone_device.cooling_devices is not accurate
as this is a list for thermal instances, rather than cooling devices.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui
b81b6ba3d9 Thermal: rename structure thermal_cooling_device_instance to thermal_instance
This struct is used to describe the behavior for a thermal
cooling device on a certain trip point for a certain thremal zone.

thermal_cooling_device_instance is not accurate, as a cooling device
can be used for more than one trip point in one thermal zone device.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui
4ae46befb4 Thermal: Introduce thermal_zone_trip_update()
This function is used to update the cooling state of
all the cooling devices that are bound to an active trip point.

This will be used for passive cooling as well, in the future patches.
as both active and passive cooling can share the same algorithm,
which is

1. if the temperature is higher than a trip point,
   a. if the trend is THERMAL_TREND_RAISING, use higher cooling
      state for this trip point
   b. if the trend is THERMAL_TREND_DROPPING, use lower cooling
      state for this trip point

2. if the temperature is lower than a trip point, use lower
   cooling state for this trip point.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui
1b7ddb840c Thermal: Remove tc1/tc2 in generic thermal layer.
Remove tc1/tc2 in generic thermal layer.
.get_trend() callback starts to take effect from this patch.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
2012-09-24 14:44:36 +08:00
Zhang Rui
601f3d4242 Thermal: Introduce .get_trend() callback.
According to ACPI spec, tc1 and tc2 are used by OSPM
to anticipate the temperature trends.
We introduced the same concept to the generic thermal layer
for passive cooling, but now it seems that these values
are hard to be used on other platforms.

So We introduce .get_trend() as a more general solution.

For the platform thermal drivers that have their own way to
anticipate the temperature trends, they should provide
their own .get_trend() callback.
Or else, we will calculate the temperature trends by simply
comparing the current temperature and the cached previous
temperature reading.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
2012-09-24 14:44:36 +08:00
Zhang Rui
9d99842f99 Thermal: set upper and lower limits
set upper and lower limits when binding
a thermal cooling device to a thermal zone device.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:36 +08:00
Zhang Rui
74051ba505 Thermal: Introduce cooling states range support
As the active cooling devices can have multiple cooling states,
we may want only several cooling states for a certain trip point,
and other cooling states for other active trip points.

To do this, we should be able to describe the cooling device
behavior for a certain trip point, rather than for the entire thermal zone.
And when updating thermal zone, we need to check the upper and lower limit
to make sure the cooling device is set to the proper cooling state.

Note that this patch will not bring any different behavior as
upper limit is set to max_state and lower limit is set to 0
in this patch, for now.

Next patch will set these to real values.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:36 +08:00
Zhang Rui
e3f25e6e58 Thermal: Introduce multiple cooling states support
This is because general active cooling devices, like fans,
may have multiple speeds, which can be mapped to different cooling states.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
2012-09-24 14:44:36 +08:00
Tejun Heo
41f63c5359 workqueue: use mod_delayed_work() instead of cancel + queue
Convert delayed_work users doing cancel_delayed_work() followed by
queue_delayed_work() to mod_delayed_work().

Most conversions are straight-forward.  Ones worth mentioning are,

* drivers/edac/edac_mc.c: edac_mc_workq_setup() converted to always
  use mod_delayed_work() and cancel loop in
  edac_mc_reset_delay_period() is dropped.

* drivers/platform/x86/thinkpad_acpi.c: No need to remember whether
  watchdog is active or not.  @fan_watchdog_active and related code
  dropped.

* drivers/power/charger-manager.c: Seemingly a lot of
  delayed_work_pending() abuse going on here.
  [delayed_]work_pending() are unsynchronized and racy when used like
  this.  I converted one instance in fullbatt_handler().  Please
  conver the rest so that it invokes workqueue APIs for the intended
  target state rather than trying to game work item pending state
  transitions.  e.g. if timer should be modified - call
  mod_delayed_work(), canceled - call cancel_delayed_work[_sync]().

* drivers/thermal/thermal_sys.c: thermal_zone_device_set_polling()
  simplified.  Note that round_jiffies() calls in this function are
  meaningless.  round_jiffies() work on absolute jiffies not delta
  delay used by delayed_work.

v2: Tomi pointed out that __cancel_delayed_work() users can't be
    safely converted to mod_delayed_work().  They could be calling it
    from irq context and if that happens while delayed_work_timer_fn()
    is running, it could deadlock.  __cancel_delayed_work() users are
    dropped.

Signed-off-by: Tejun Heo <tj@kernel.org>
Acked-by: Henrique de Moraes Holschuh <hmh@hmh.eng.br>
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Acked-by: Anton Vorontsov <cbouatmailru@gmail.com>
Acked-by: David Howells <dhowells@redhat.com>
Cc: Tomi Valkeinen <tomi.valkeinen@ti.com>
Cc: Jens Axboe <axboe@kernel.dk>
Cc: Jiri Kosina <jkosina@suse.cz>
Cc: Doug Thompson <dougthompson@xmission.com>
Cc: David Airlie <airlied@linux.ie>
Cc: Roland Dreier <roland@kernel.org>
Cc: "John W. Linville" <linville@tuxdriver.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Len Brown <len.brown@intel.com>
Cc: "J. Bruce Fields" <bfields@fieldses.org>
Cc: Johannes Berg <johannes@sipsolutions.net>
2012-08-13 16:27:37 -07:00
Linus Torvalds
4b24ff7110 The tag contains just a few battery-related changes for v3.6. It's is
all pretty straightforward, except one thing.
 
 One of our patches added thermal support for power supply class, but
 thermal/ subsystem changed under our feet. We (well, Stephen, that is)
 caught the issue and it was decided[1] that I'd just delay the battery
 pull request, and then will fix it up by merging upstream back into
 battery tree at the specific commit.
 
 That's not all though: another[2] small fixup for thermal subsystem was
 needed to get rid of a warning in power supply subsystem (the warning
 was not drivers/power's "fault", the thermal registration function just
 needed a proper const annotation, which is also done by a small commit
 on top of the merge.
 
 So, to sum this up:
 - The 'master' branch of the battery tree was in the -next tree for
   weeks, was never rebased, altered etc. It should be all OK;
 - Although, for-v3.6 tag contains the 'master' branch + merge + the
   warning fix.
 
 [1] http://lkml.org/lkml/2012/6/19/23
 [2] http://lkml.org/lkml/2012/6/18/28
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Merge tag 'for-v3.6' of git://git.infradead.org/battery-2.6

Pull battery updates from Anton Vorontsov:
 "The tag contains just a few battery-related changes for v3.6.  It's is
  all pretty straightforward, except one thing.

  One of our patches added thermal support for power supply class, but
  thermal/ subsystem changed under our feet.  We (well, Stephen, that
  is) caught the issue and it was decided[1] that I'd just delay the
  battery pull request, and then will fix it up by merging upstream back
  into battery tree at the specific commit.

  That's not all though: another[2] small fixup for thermal subsystem
  was needed to get rid of a warning in power supply subsystem (the
  warning was not drivers/power's "fault", the thermal registration
  function just needed a proper const annotation, which is also done by
  a small commit on top of the merge.

  So, to sum this up:
   - The 'master' branch of the battery tree was in the -next tree for
     weeks, was never rebased, altered etc.  It should be all OK;
   - Although, for-v3.6 tag contains the 'master' branch + merge + the
     warning fix.

  [1] http://lkml.org/lkml/2012/6/19/23
  [2] http://lkml.org/lkml/2012/6/18/28"

* tag 'for-v3.6' of git://git.infradead.org/battery-2.6: (23 commits)
  thermal: Constify 'type' argument for the registration routine
  olpc-battery: update CHARGE_FULL_DESIGN property for BYD LiFe batteries
  olpc-battery: Add VOLTAGE_MAX_DESIGN property
  charger-manager: Fix build break related to EXTCON
  lp8727_charger: Move header file into platform_data directory
  power_supply: Add min/max alert properties for CAPACITY, TEMP, TEMP_AMBIENT
  bq27x00_battery: Add support for BQ27425 chip
  charger-manager: Set current limit of regulator for over current protection
  charger-manager: Use EXTCON Subsystem to detect charger cables for charging
  test_power: Add VOLTAGE_NOW and BATTERY_TEMP properties
  test_power: Add support for USB AC source
  gpio-charger: Use cansleep version of gpio_set_value
  bq27x00_battery: Add support for power average and health properties
  sbs-battery: Don't trigger false supply_changed event
  twl4030_charger: Allow charger to control the regulator that feeds it
  twl4030_charger: Add backup-battery charging
  twl4030_charger: Fix some typos
  max17042_battery: Support CHARGE_COUNTER power supply attribute
  smb347-charger: Add constant charge and current properties
  power_supply: Add constant charge_current and charge_voltage properties
  ...
2012-07-31 18:08:25 -07:00
Anton Vorontsov
4b1bf5871f thermal: Constify 'type' argument for the registration routine
thermal_zone_device_register() does not modify 'type' argument, so it is
safe to declare it as const. Otherwise, if we pass a const string, we are
getting the ugly warning:

CC drivers/power/power_supply_core.o
drivers/power/power_supply_core.c: In function 'psy_register_thermal':
drivers/power/power_supply_core.c:204:6: warning: passing argument 1 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type [enabled by default]
include/linux/thermal.h:140:29: note: expected 'char *' but argument is of type 'const char *'

Signed-off-by: Anton Vorontsov <anton.vorontsov@linaro.org>
Acked-by: Jean Delvare <khali@linux-fr.org>
2012-07-31 05:45:37 -07:00
Len Brown
ec033d0a02 Merge branches 'acpi_pad', 'acpica', 'apei-bugzilla-43282', 'battery', 'cpuidle-coupled', 'cpuidle-tweaks', 'intel_idle-ivb', 'ost', 'red-hat-bz-772730', 'thermal', 'thermal-spear' and 'turbostat-v2' into release 2012-07-26 00:03:58 -04:00
Durgadoss R
27365a6c7d Thermal: Add Hysteresis attributes
The Linux Thermal Framework does not support hysteresis
attributes. Most thermal sensors, today, have a
hysteresis value associated with trip points.

This patch adds hysteresis attributes on a per-trip-point
basis, to the Thermal Framework. These attributes are
optionally writable.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-07-24 23:19:26 -04:00
Durgadoss R
c56f5c0342 Thermal: Make Thermal trip points writeable
Some of the thermal drivers using the Generic Thermal Framework
require (all/some) trip points to be writeable. This patch makes
the trip point temperatures writeable on a per-trip point basis,
and modifies the required function call in thermal.c. This patch
also updates the Documentation to reflect the new change.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-07-24 23:17:20 -04:00
Viresh Kumar
b9c7aff481 drivers/thermal/spear_thermal.c: add Device Tree probing capability
SPEAr platforms now support DT and so must convert all drivers to support
DT.  This patch adds DT probing support for SPEAr thermal sensor driver
and updates its documentation too.

Also, as SPEAr is the only user of this driver and is only available with
DT, make this an only DT driver.  So, platform_data is completely removed
and passed via DT now.

Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Cc: Dan Carpenter <dan.carpenter@oracle.com>
Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-06-02 01:49:38 -04:00
Amit Daniel Kachhap
f1f0e2ac59 thermal: Fix for setting the thermal zone mode to enable/disable
Basically without this patch changing the mode of thermal zone
is not possible as wrong string size is passed to strncmp.

Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:10:18 -04:00
Dan Carpenter
03ee62f0b9 thermal: spear13xx: checking for NULL instead of IS_ERR()
thermal_zone_device_register() never returns NULL, on error it returns and
ERR_PTR().

Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Reviewed-by: Viresh Kumar <viresh.kumar@st.com>
Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:07:22 -04:00
Viresh Kumar
de716e32e6 thermal/spear_thermal: replace readl/writel with lighter _relaxed variants
readl/writel versions for ARM contain memory barrier instruction for
synchronizing DMA buffers.  These are not required at least on this
module.  So use lighter _relaxed variants.

Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:06:43 -04:00
Vincenzo Frascino
6a92c36688 thermal: add support for thermal sensor present on SPEAr13xx machines
ST's SPEAr13xx machines are based on CortexA9 ARM processors.  These
machines contain a thermal sensor for junction temperature monitoring.

This patch adds support for this thermal sensor in existing thermal
framework.

[akpm@linux-foundation.org: little code cleanup]
[akpm@linux-foundation.org: print the pointer correctly]
[viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR]
Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com>
Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:05:32 -04:00
Joe Perches
c5a01dd52d thermal_sys: convert printks to pr_<level>
Use the current logging style.

Remove PREFIX, add pr_fmt, convert the printks.  All dmesg output now
prefixed with "thermal_sys: ".

Signed-off-by: Joe Perches <joe@perches.com>
Cc: Jesper Juhl <jj@chaosbits.net>
Cc: Len Brown <lenb@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:04:40 -04:00
Joe Perches
caca8b8035 thermal_sys: kernel style cleanups
Just a few tidies to make it more like most kernel sources.

A couple of long lines still remain.

Signed-off-by: Joe Perches <joe@perches.com>
Reviewed-by: Jesper Juhl <jj@chaosbits.net>
Cc: Len Brown <lenb@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:03:09 -04:00
Joe Perches
ec79768560 thermal_sys: remove obfuscating used-once macros
These don't add any value as they are used only once and the surrounding
code uses similar variable.

Signed-off-by: Joe Perches <joe@perches.com>
Cc: Jesper Juhl <jj@chaosbits.net>
Cc: Len Brown <lenb@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:02:31 -04:00
Joe Perches
886ee54635 thermal_sys: remove unnecessary line continuations
Line continations are not necessary in function calls or statements.
Remove them.

Signed-off-by: Joe Perches <joe@perches.com>
Reviewed-by: Jesper Juhl <jj@chaosbits.net>
Cc: Len Brown <lenb@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:01:46 -04:00
Fabio Estevam
b11de07ce5 drivers/thermal/thermal_sys.c: fix build warning
With CONFIG_NET=n:

drivers/thermal/thermal_sys.c:63: warning: 'thermal_event_seqnum' defined but not used

Move 'thermal_event_seqnum' definition inside the '#ifdef CONFIG_NET'

[akpm@linux-foundation.org: make thermal_event_seqnum local to generate_netlink_event()]
Signed-off-by: Fabio Estevam <fabio.estevam@freescale.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Cc: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:01:27 -04:00
Jean Delvare
2d58d7ea91 thermal: Rename generate_netlink_event
It doesn't seem right for the thermal subsystem to export a symbol
named generate_netlink_event. This function is thermal-specific and
its name should reflect that fact. Rename it to
thermal_generate_netlink_event.

Signed-off-by: Jean Delvare <khali@linux-fr.org>
Acked-by: Rafael J. Wysocki <rjw@sisk.pl>
Acked-by: R.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-01-23 03:15:25 -05:00
Rafael J. Wysocki
51e20d0e3a thermal: Prevent polling from happening during system suspend
The thermal driver should use a freezable workqueue to schedule
polling to prevent thermal_zone_device_update() from being run
during system suspend, when the devices it relies on may be inactive.
Make it use the system freezable workqueue for this purpose.

Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl>
Signed-off-by: Len Brown <len.brown@intel.com>
2011-11-06 20:38:49 -05:00
Jean Delvare
31f5396ad3 thermal: make THERMAL_HWMON implementation fully internal
THERMAL_HWMON is implemented inside the thermal_sys driver and has no
effect on drivers implementing thermal zones, so they shouldn't see
anything related to it in <linux/thermal.h>.  Making the THERMAL_HWMON
implementation fully internal has two advantages beyond the cleaner
design:

* This avoids rebuilding all thermal drivers if the THERMAL_HWMON
  implementation changes, or if CONFIG_THERMAL_HWMON gets enabled or
  disabled.

* This avoids breaking the thermal kABI in these cases too, which should
  make distributions happy.

The only drawback I can see is slightly higher memory fragmentation, as
the number of kzalloc() calls will increase by one per thermal zone.  But
I doubt it will be a problem in practice, as I've never seen a system with
more than two thermal zones.

Signed-off-by: Jean Delvare <khali@linux-fr.org>
Cc: Rene Herman <rene.herman@gmail.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2011-08-02 14:51:57 -04:00
Jean Delvare
0d97d7a494 thermal: split hwmon lookup to a separate function
We'll soon need to reuse it.

Signed-off-by: Jean Delvare <khali@linux-fr.org>
Cc: Rene Herman <rene.herman@gmail.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2011-08-02 14:51:41 -04:00
Jean Delvare
ab92402af0 thermal: hide CONFIG_THERMAL_HWMON
It's about time to revert 16d7523973 ("thermal: Create
CONFIG_THERMAL_HWMON=n").  Anybody running a kernel >= 2.6.40 would also
be running a recent enough version of lm-sensors.

Actually having CONFIG_THERMAL_HWMON is pretty convenient so instead of
dropping it, we keep it but hide it.

Signed-off-by: Jean Delvare <khali@linux-fr.org>
Cc: Rene Herman <rene.herman@gmail.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2011-08-02 14:51:25 -04:00
Durgadoss R
b299eb5cde ACPI:Fix goto flows in thermal-sys
This patch fixes two minor bugs in thermal_sys:
(a) The flow of goto's in thermal_hwmon_add_sysfs.
(b) Remove the temp*_crit only if there is a get_crit_temp defined, in
    thermal_remove_hwmon_sysfs.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2011-03-23 01:43:44 -04:00
Rafael J. Wysocki
af06216a8e ACPI: Fix build for CONFIG_NET unset
Several ACPI drivers fail to build if CONFIG_NET is unset, because
they refer to things depending on CONFIG_THERMAL that in turn depends
on CONFIG_NET.  However, CONFIG_THERMAL doesn't really need to depend
on CONFIG_NET, because the only part of it requiring CONFIG_NET is
the netlink interface in thermal_sys.c.

Put the netlink interface in thermal_sys.c under #ifdef CONFIG_NET
and remove the dependency of CONFIG_THERMAL on CONFIG_NET from
drivers/thermal/Kconfig.

Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl>
Acked-by: Randy Dunlap <randy.dunlap@oracle.com>
Cc: Ingo Molnar <mingo@elte.hu>
Cc: Len Brown <lenb@kernel.org>
Cc: Stephen Rothwell <sfr@canb.auug.org.au>
Cc: Luming Yu <luming.yu@intel.com>
Cc: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2011-02-28 18:00:31 -08:00