Commit Graph

100 Commits

Author SHA1 Message Date
Daniel Lezcano
32a7a02117 thermal/core: Relocate the traces definition in thermal directory
The traces are exported but only local to the thermal core code. On
the other side, the traces take the thermal zone device structure as
argument, thus they have to rely on the exported thermal.h header
file. As we want to move the structure to the private thermal core
header, first we have to relocate those traces to the same place as
many drivers do.

Cc: Steven Rostedt <rostedt@goodmis.org>
Suggested-by: Steven Rostedt <rostedt@goodmis.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Steven Rostedt (Google) <rostedt@goodmis.org>
Link: https://lore.kernel.org/r/20230307133735.90772-2-daniel.lezcano@linaro.org
2023-04-01 20:51:45 +02:00
Balsam CHIHI
fad399ebdd thermal/drivers/mediatek: Relocate driver to mediatek folder
Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it, and rename it
as "auxadc_thermal.c" to show its purpose more clearly.

Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:28:25 +01:00
Rafael J. Wysocki
c3bd6d539f Merge branch 'thermal-core'
Merge thermal control core changes for 6.3-rc1:

 - Clean up thermal device unregistration code (Viresh Kumar).

 - Fix and clean up thermal control core initialization error code
   paths (Daniel Lezcano).

 - Relocate the trip points handling code into a separate file (Daniel
   Lezcano).

 - Make the thermal core fail registration of thermal zones and cooling
   devices if the thermal class has not been registered (Rafael Wysocki).

 - Make the core thermal control code use sysfs_emit_at() instead of
   scnprintf() where applicable (ye xingchen).

* thermal-core:
  thermal: core: Use sysfs_emit_at() instead of scnprintf()
  thermal: Fail object registration if thermal class is not registered
  thermal/core: Move the thermal trip code to a dedicated file
  thermal/core: Remove unneeded ida_destroy()
  thermal/core: Fix unregistering netlink at thermal init time
  thermal: core: Use device_unregister() instead of device_del/put()
  thermal: core: Move cdev cleanup to thermal_release()
2023-02-15 17:08:30 +01:00
Daniel Lezcano
5b8de18ee9 thermal/core: Move the thermal trip code to a dedicated file
The thermal_core.c files contains a lot of functions handling
different thermal components like the governors, the trip points, the
cooling device, the OF cooling device, etc ...

This organization does not help to migrate to a more sane code where
there is a better self-encapsulation as all the components' internals
can be directly accessed from a single file.

For the sake of clarity, let's move the thermal trip points code in a
dedicated thermal_trip.c file and add a function to browse all the
trip points like we do with the thermal zones, the govenors and the
cooling devices.

The same can be done for the cooling devices and the governor code but
that will come later as the current work in the thermal framework is
to fix the trip point handling and use a generic trip point structure.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-01-25 16:40:39 +01:00
Rafael J. Wysocki
7a0e397488 thermal: ACPI: Add ACPI trip point routines
Add library routines to populate a generic thermal trip point
structure with data obtained by evaluating a specific object in the
ACPI Namespace.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2023-01-24 21:13:42 +01:00
Jonathan Cameron
34dc523bba thermal/drivers/qcom: Drop false build dependency of all QCOM drivers on QCOM_TSENS
The SPMI QCOM drivers have no dependency in Kconfig, but the Makefile
will not be included without QCOM_TSENS. This unnecessarily reduces
build coverage.

Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Cc: Bhupesh Sharma <bhupesh.sharma@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Reviewed-by: Bhupesh Sharma <bhupesh.sharma@linaro.org>
Link: https://lore.kernel.org/r/20220821160032.2206349-1-jic23@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-10-04 11:21:11 +02:00
Keerthy
ffcb2fc86e thermal: k3_j72xx_bandgap: Add the bandgap driver support
Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 J72XX supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.

Currently reading temperatures only is supported.  There are no
active/passive cooling agent supported.

J721e SoCs have errata i2128: https://www.ti.com/lit/pdf/sprz455

The VTM Temperature Monitors (TEMPSENSORs) are trimmed during production,
with the resulting values stored in software-readable registers. Software
should use these  register values when translating the Temperature
Monitor output codes to temperature values.

It has an involved workaround. Software needs to read the error codes for
-40C, 30C, 125C from the efuse for each device & derive a new look up table
for adc to temperature conversion. Involved calculating slopes & constants
using 3 different straight line equations with adc refernce codes as the
y-axis & error codes in the x-axis.

-40C to 30C
30C to 125C
125C to 150C

With the above 2 line equations we derive the full look-up table to
workaround the errata i2128 for j721e SoC.

Tested temperature reading on J721e SoC & J7200 SoC.

[daniel.lezcano@linaro.org: Generate look-up tables run-time]

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Link: https://lore.kernel.org/r/20220517172920.10857-3-j-keerthy@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19 12:11:53 +02:00
Biju Das
673c68bd48 thermal/drivers: Add TSU driver for RZ/G2L
The RZ/G2L SoC incorporates a thermal sensor unit (TSU) that measures the
temperature inside the LSI.

The thermal sensor in this unit measures temperatures in the range from
−40 degree Celsius to 125 degree Celsius with an accuracy of ±3°C. The
TSU repeats measurement at 20 microseconds intervals and automatically
updates the results of measurement.

The TSU has no interrupts as well as no external pins.

This patch adds Thermal Sensor Unit(TSU) driver for RZ/G2L SoC.

Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Link: https://lore.kernel.org/r/20211130155757.17837-3-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2021-11-30 17:27:56 +01:00
Arnd Bergmann
73da3f0cca thermal/drivers/zx: Remove zx driver
The zte zx platform is getting removed, so this driver is no
longer needed.

Cc: Jun Nie <jun.nie@linaro.org>
Cc: Shawn Guo <shawnguo@kernel.org>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-3-arnd@kernel.org
2021-02-03 09:17:47 +01:00
Arnd Bergmann
8fefe3ce6b thermal/drivers/tango: Remove tango driver
The tango platform is getting removed, so the driver is no
longer needed.

Cc: Marc Gonzalez <marc.w.gonzalez@free.fr>
Cc: Mans Rullgard <mans@mansr.com>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Mans Rullgard <mans@mansr.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-2-arnd@kernel.org
2021-02-03 09:16:54 +01:00
Linus Torvalds
884e0d3dd5 - Core Frameworks
- Make better attempt at matching device with the correct OF node
    - Allow batch removal of hierarchical sub-devices
 
  - New Drivers
    - Add STM32 Clocksource driver
    - Add support for Khadas System Control Microcontroller
 
  - Driver Removal
    - Remove unused driver for TI's SMSC ECE1099
 
  - New Device Support
    - Add support for Intel Emmitsburg PCH to Intel LPSS PCI
    - Add support for Intel Tiger Lake PCH-H to Intel LPSS PCI
    - Add support for Dialog DA revision to Dialog DA9063
 
  - New Functionality
    - Add support for AXP803 to be probed by I2C
 
  - Fix-ups
    - Numerous W=1 warning fixes
    - Device Tree changes; stm32-lptimer, gateworks-gsc, khadas,mcu, stmfx, cros-ec, j721e-system-controller
    - Enabled Regmap 'fast I/O'; stm32-lptimer
    - Change BUG_ON to WARN_ON; arizona-core
    - Remove superfluous code/initialisation; madera, max14577
    - Trivial formatting/spelling issues; madera-core, madera-i2c, da9055, max77693-private
    - Switch to of_platform_populate(); sprd-sc27xx-spi
    - Expand out set/get brightness/pwm macros; lm3533-ctrlbank
    - Disable IRQs on suspend; motorola-cpcap
    - Clean-up error handling; intel_soc_pmic_mrfld
    - Ensure correct removal order of sub-devices; madera
    - Many s/HTTP/HTTPS/ link changes
    - Ensure name used with Regmap is unique; syscon
 
  - Bug Fixes
    - Properly 'put' clock on unbind and error; arizona-core
    - Fix revision handling; da9063
    - Fix 'assignment of read-only location' error; kempld-core
    - Avoid using the Regmap API when atomic; rn5t618
    - Redefine volatile register description; rn5t618
    - Use locking to protect event handler; dln2
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Merge tag 'mfd-next-5.9-1' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd

Pull MFD updates from Lee Jones:
 "Core Frameworks
   - Make better attempt at matching device with the correct OF node
   - Allow batch removal of hierarchical sub-devices

  New Drivers
   - Add STM32 Clocksource driver
   - Add support for Khadas System Control Microcontroller

  Driver Removal
   - Remove unused driver for TI's SMSC ECE1099

  New Device Support
   - Add support for Intel Emmitsburg PCH to Intel LPSS PCI
   - Add support for Intel Tiger Lake PCH-H to Intel LPSS PCI
   - Add support for Dialog DA revision to Dialog DA9063

  New Functionality
   - Add support for AXP803 to be probed by I2C

  Fix-ups
   - Numerous W=1 warning fixes
   - Device Tree changes (stm32-lptimer, gateworks-gsc, khadas,mcu, stmfx, cros-ec, j721e-system-controller)
   - Enabled Regmap 'fast I/O' in stm32-lptimer
   - Change BUG_ON to WARN_ON in arizona-core
   - Remove superfluous code/initialisation (madera, max14577)
   - Trivial formatting/spelling issues (madera-core, madera-i2c, da9055, max77693-private)
   - Switch to of_platform_populate() in sprd-sc27xx-spi
   - Expand out set/get brightness/pwm macros in lm3533-ctrlbank
   - Disable IRQs on suspend in motorola-cpcap
   - Clean-up error handling in intel_soc_pmic_mrfld
   - Ensure correct removal order of sub-devices in madera
   - Many s/HTTP/HTTPS/ link changes
   - Ensure name used with Regmap is unique in syscon

  Bug Fixes
   - Properly 'put' clock on unbind and error in arizona-core
   - Fix revision handling in da9063
   - Fix 'assignment of read-only location' error in kempld-core
   - Avoid using the Regmap API when atomic in rn5t618
   - Redefine volatile register description in rn5t618
   - Use locking to protect event handler in dln2"

* tag 'mfd-next-5.9-1' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd: (76 commits)
  mfd: syscon: Use a unique name with regmap_config
  mfd: Replace HTTP links with HTTPS ones
  mfd: dln2: Run event handler loop under spinlock
  mfd: madera: Improve handling of regulator unbinding
  mfd: mfd-core: Add mechanism for removal of a subset of children
  mfd: intel_soc_pmic_mrfld: Simplify the return expression of intel_scu_ipc_dev_iowrite8()
  mfd: max14577: Remove redundant initialization of variable current_bits
  mfd: rn5t618: Fix caching of battery related registers
  mfd: max77693-private: Drop a duplicated word
  mfd: da9055: pdata.h: Drop a duplicated word
  mfd: rn5t618: Make restart handler atomic safe
  mfd: kempld-core: Fix 'assignment of read-only location' error
  mfd: axp20x: Allow the AXP803 to be probed by I2C
  mfd: da9063: Add support for latest DA silicon revision
  mfd: da9063: Fix revision handling to correctly select reg tables
  dt-bindings: mfd: st,stmfx: Remove I2C unit name
  dt-bindings: mfd: ti,j721e-system-controller.yaml: Add J721e system controller
  mfd: motorola-cpcap: Disable interrupt for suspend
  mfd: smsc-ece1099: Remove driver
  mfd: core: Add OF_MFD_CELL_REG() helper
  ...
2020-08-15 08:09:38 -07:00
Amit Kucheria
af0e5f1f47 thermal/drivers/clock_cooling: Remove clock_cooling code
clock_cooling has no in-kernel users. It has never found any use in
drivers as far as I can tell.

Remove the code.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/aa5d5ac2589cf7b14ece882130731b4a916849a6.1593619943.git.amit.kucheria@linaro.org
2020-07-21 10:40:08 +02:00
Daniel Lezcano
5b8583d3bd thermal: netlink: Fix compilation error when CONFIG_NET=n
When the network is not configured, the netlink is disabled on all
the system. The thermal framework assumed the netlink is always
opt-in.

Fix this by adding a Kconfig option for the netlink notification,
defaulting to yes and depending on CONFIG_NET.

As the change implies multiple stubs and in order to not pollute the
internal thermal header, the thermal_nelink.h has been added and
included in the thermal_core.h, so this one regain some kind of
clarity.

Reported-by: Randy Dunlap <rdunlap@infradead.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20200707090159.1018-1-daniel.lezcano@linaro.org
2020-07-21 10:39:17 +02:00
Daniel Lezcano
1ce50e7d40 thermal: core: genetlink support for events/cmd/sampling
Initially the thermal framework had a very simple notification
mechanism to send generic netlink messages to the userspace.

The notification function was never called from anywhere and the
corresponding dead code was removed. It was probably a first attempt
to introduce the netlink notification.

At LPC2018, the presentation "Linux thermal: User kernel interface",
proposed to create the notifications to the userspace via a kfifo.

The advantage of the kfifo is the performance. It is usually used from
a 1:1 communication channel where a driver captures data and sends it
as fast as possible to a userspace process.

The drawback is that only one process uses the notification channel
exclusively, thus no other process is allowed to use the channel to
get temperature or notifications.

This patch defines a generic netlink API to discover the current
thermal setup and adds event notifications as well as temperature
sampling. As any genetlink protocol, it can evolve and the versioning
allows to keep the backward compatibility.

In order to prevent the user from getting flooded with data on a
single channel, there are two multicast channels, one for the
temperature sampling when the thermal zone is updated and another one
for the events, so the user can get the events only without the
thermal zone temperature sampling.

Also, a list of commands to discover the thermal setup is added and
can be extended when needed.

Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200706105538.2159-3-daniel.lezcano@linaro.org
2020-07-07 15:55:21 +02:00
Neil Armstrong
5772717e59 thermal: Add support for the MCU controlled FAN on Khadas boards
The new Khadas VIM2 and VIM3 boards controls the cooling fan via the
on-board microcontroller.

This implements the FAN control as thermal devices and as cell of the Khadas
MCU MFD driver.

Signed-off-by: Neil Armstrong <narmstrong@baylibre.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
2020-06-25 07:44:20 +01:00
Amit Kucheria
14adf6c83f thermal/of: Rename of-thermal.c
Core thermal framework code files should start with thermal_*.
of-thermal.c does not follow this pattern and can easily be confused
with platform driver.

Fix this by renaming it to thermal_of.c

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/f5e233d5c5dcc7c7cb56b3448da255cb2c9ef0d1.1589199124.git.amit.kucheria@linaro.org
2020-05-22 18:48:54 +02:00
Amit Kucheria
0015d9a2a7 thermal/governors: Prefix all source files with gov_
Bang-bang governor source file is prefixed with gov_. Do the same for
other governors for consistency so they're easy to find in the sources.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/b9a85d3204712f14e320504948c12712dc0b291b.1589199124.git.amit.kucheria@linaro.org
2020-05-22 18:48:54 +02:00
Keerthy
48b2bce8c7 thermal: k3: Add support for bandgap sensors
Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 AM654 supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.

Currently reading temperatures only is supported.  There are no
active/passive cooling agent supported.

Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200407055116.16082-3-j-keerthy@ti.com
2020-04-14 11:41:12 +02:00
Anson Huang
5eed800a68 thermal: imx8mm: Add support for i.MX8MM thermal monitoring unit
i.MX8MM has a thermal monitoring unit(TMU) inside, it ONLY has one
sensor for CPU, add support for reading immediate temperature of
this sensor.

Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582947862-11073-2-git-send-email-Anson.Huang@nxp.com
2020-03-12 11:56:53 +01:00
Anson Huang
e20db70dba thermal: imx_sc: add i.MX system controller thermal support
i.MX8QXP is an ARMv8 SoC which has a Cortex-M4 system controller
inside, the system controller is in charge of controlling power,
clock and thermal sensors etc..

This patch adds i.MX system controller thermal driver support,
Linux kernel has to communicate with system controller via MU
(message unit) IPC to get each thermal sensor's temperature,
it supports multiple sensors which are passed from device tree,
please see the binding doc for details.

Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582330132-13461-3-git-send-email-Anson.Huang@nxp.com
2020-03-12 11:40:57 +01:00
Freeman Liu
554fdbaf19 thermal: sprd: Add Spreadtrum thermal driver support
This patch adds the support for Spreadtrum thermal sensor controller,
which can support maximum 8 sensors.

Signed-off-by: Freeman Liu <freeman.liu@unisoc.com>
Co-developed-with: Baolin Wang <baolin.wang@unisoc.com>
Signed-off-by: Baolin Wang <baolin.wang7@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/ebeb2839cff4d4027b37e787427c5af0e11880c8.1582013101.git.baolin.wang7@gmail.com
2020-03-12 11:40:57 +01:00
Yangtao Li
dccc5c3b6f thermal/drivers/sun8i: Add thermal driver for H6/H5/H3/A64/A83T/R40
This patch adds the support for allwinner thermal sensor, within
allwinner SoC. It will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Ondrej Jirman <megous@megous.com>
Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Maxime Ripard <mripard@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219172823.1652600-2-anarsoul@gmail.com
2020-01-27 10:24:32 +01:00
Daniel Lezcano
23affa2e29 thermal/drivers/cpu_cooling: Rename to cpufreq_cooling
As we introduced the idle injection cooling device called
cpuidle_cooling, let's be consistent and rename the cpu_cooling to
cpufreq_cooling as this one mitigates with OPPs changes.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-3-daniel.lezcano@linaro.org
2020-01-27 10:24:32 +01:00
Daniel Lezcano
a4c428e523 thermal/drivers/cpu_cooling: Introduce the cpu idle cooling driver
The cpu idle cooling device offers a new method to cool down a CPU by
injecting idle cycles at runtime.

It has some similarities with the intel power clamp driver but it is
actually designed to be more generic and relying on the idle injection
powercap framework.

The idle injection duration is fixed while the running duration is
variable. That allows to have control on the device reactivity for the
user experience.

An idle state powering down the CPU or the cluster will allow to drop
the static leakage, thus restoring the heat capacity of the SoC. It
can be set with a trip point between the hot and the critical points,
giving the opportunity to prevent a hard reset of the system when the
cpufreq cooling fails to cool down the CPU.

With more sophisticated boards having a per core sensor, the idle
cooling device allows to cool down a single core without throttling
the compute capacity of several cpus belonging to the same clock line,
so it could be used in collaboration with the cpufreq cooling device.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org
2020-01-27 10:24:32 +01:00
Daniel Lezcano
2b586feab4 thermal/drivers/Kconfig: Convert the CPU cooling device to a choice
The next changes will add a new way to cool down a CPU by injecting
idle cycles. With the current configuration, a CPU cooling device is
the cpufreq cooling device. As we want to add a new CPU cooling
device, let's convert the CPU cooling to a choice giving a list of CPU
cooling devices. At this point, there is obviously only one CPU
cooling device.

There is no functional changes.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20191204153930.9128-1-daniel.lezcano@linaro.org
2020-01-27 10:24:32 +01:00
Guillaume La Roque
421eda108e thermal: amlogic: Add thermal driver to support G12 SoCs
Amlogic G12A and G12B SoCs integrate two thermal sensors
with the same design. One is located close to the DDR controller
and the other one is located close to the PLLs (between the CPU and GPU).

The calibration data for each of the thermal sensors instance is stored
in a different location within the AO region.

Implement reading the temperature from each thermal sensor.

The IP block has more functionality, which may be added to this driver
in the future:
- chip reset when the temperature exceeds a configurable threshold
- up to four interrupts when the temperature has risen above a
configurable threshold
- up to four interrupts when the temperature has fallen below a
configurable threshold

Tested-by: Christian Hewitt <christianshewitt@gmail.com>
Tested-by: Kevin Hilman <khilman@baylibre.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Guillaume La Roque <glaroque@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191004090114.30694-3-glaroque@baylibre.com
2019-11-07 07:00:26 +01:00
Talel Shenhar
71aa369349 thermal: Introduce Amazon's Annapurna Labs Thermal Driver
This is a generic thermal driver for simple MMIO sensors, of which
amazon,al-thermal is one.

This device uses a single MMIO transaction to read the temperature and
report it to the thermal subsystem.

Signed-off-by: Talel Shenhar <talel@amazon.com>
Reviewed-by: David Woodhouse <dwmw@amazon.co.uk>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2019-05-14 07:00:26 -07:00
Amit Kucheria
72e9baf997 drivers: thermal: Move QCOM_SPMI_TEMP_ALARM into the qcom subdir
This cleans up the directory a bit allowing just one place to look for
thermal related drivers for QCOM platforms instead of being scattered in
the root directory and the qcom/ subdirectory. Compile-tested with
ARCH=arm64 defconfig and the driver explicitly enabled with menuconfig.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-12-07 16:49:02 +08:00
Amit Kucheria
3e8c4d31f8 drivers: thermal: Move various drivers for intel platforms into a subdir
This cleans up the directory a bit, now that we have several other
platforms using platform-specific sub-directories. Compile-tested with
ARCH=x86 defconfig and the drivers explicitly enabled with menuconfig.

Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-12-07 16:48:47 +08:00
David HERNANDEZ SANCHEZ
1d69315560 thermal: add stm32 thermal driver
Add support for DTS thermal sensor that can be
found on some STM32 platforms.

This driver is based on OF and works in interrupt
mode.

It offers two temperature trip points:
passive and critical. The first is intended for
passive cooling notification while the second is
used for over-temperature reset.

Signed-off-by: David Hernandez Sanchez <david.hernandezsanchez@st.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-10-25 10:44:52 -07:00
Linus Torvalds
cf9b0772f2 ARM: SoC driver updates for v4.15
This branch contains platform-related driver updates for ARM and ARM64,
 these are the areas that bring the changes:
 
 New drivers:
  - Driver support for Renesas R-Car V3M (R8A77970)
  - Power management support for Amlogic GX
  - A new driver for the Tegra BPMP thermal sensor
  - A new bus driver for Technologic Systems NBUS
 
 Changes for subsystems that prefer to merge through arm-soc:
  - The usual updates for reset controller drivers from Philipp Zabel,
    with five added drivers for SoCs in the arc, meson, socfpa, uniphier
    and mediatek families.
  - Updates to the ARM SCPI and PSCI frameworks, from Sudeep Holla,
    Heiner Kallweit and Lorenzo Pieralisi.
 
 Changes specific to some ARM-based SoC
  - The Freescale/NXP DPAA QBMan drivers from PowerPC can now work
    on ARM as well.
  - Several changes for power management on Broadcom SoCs
  - Various improvements on Qualcomm, Broadcom, Amlogic, Atmel, Mediatek
  - Minor Cleanups for Samsung, TI OMAP SoCs
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Merge tag 'armsoc-drivers' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc

Pull ARM SoC driver updates from Arnd Bergmann:
 "This branch contains platform-related driver updates for ARM and
  ARM64, these are the areas that bring the changes:

  New drivers:

   - driver support for Renesas R-Car V3M (R8A77970)

   - power management support for Amlogic GX

   - a new driver for the Tegra BPMP thermal sensor

   - a new bus driver for Technologic Systems NBUS

  Changes for subsystems that prefer to merge through arm-soc:

   - the usual updates for reset controller drivers from Philipp Zabel,
     with five added drivers for SoCs in the arc, meson, socfpa,
     uniphier and mediatek families

   - updates to the ARM SCPI and PSCI frameworks, from Sudeep Holla,
     Heiner Kallweit and Lorenzo Pieralisi

  Changes specific to some ARM-based SoC

   - the Freescale/NXP DPAA QBMan drivers from PowerPC can now work on
     ARM as well

   - several changes for power management on Broadcom SoCs

   - various improvements on Qualcomm, Broadcom, Amlogic, Atmel,
     Mediatek

   - minor Cleanups for Samsung, TI OMAP SoCs"

[ NOTE! This doesn't work without the previous ARM SoC device-tree pull,
  because the R8A77970 driver is missing a header file that came from
  that pull.

  The fact that this got merged afterwards only fixes it at this point,
  and bisection of that driver will fail if/when you walk into the
  history of that driver.           - Linus ]

* tag 'armsoc-drivers' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (96 commits)
  soc: amlogic: meson-gx-pwrc-vpu: fix power-off when powered by bootloader
  bus: add driver for the Technologic Systems NBUS
  memory: omap-gpmc: Remove deprecated gpmc_update_nand_reg()
  soc: qcom: remove unused label
  soc: amlogic: gx pm domain: add PM and OF dependencies
  drivers/firmware: psci_checker: Add missing destroy_timer_on_stack()
  dt-bindings: power: add amlogic meson power domain bindings
  soc: amlogic: add Meson GX VPU Domains driver
  soc: qcom: Remote filesystem memory driver
  dt-binding: soc: qcom: Add binding for rmtfs memory
  of: reserved_mem: Accessor for acquiring reserved_mem
  of/platform: Generalize /reserved-memory handling
  soc: mediatek: pwrap: fix fatal compiler error
  soc: mediatek: pwrap: fix compiler errors
  arm64: mediatek: cleanup message for platform selection
  soc: Allow test-building of MediaTek drivers
  soc: mediatek: place Kconfig for all SoC drivers under menu
  soc: mediatek: pwrap: add support for MT7622 SoC
  soc: mediatek: pwrap: add common way for setup CS timing extenstion
  soc: mediatek: pwrap: add MediaTek MT6380 as one slave of pwrap
  ..
2017-11-16 16:05:01 -08:00
Greg Kroah-Hartman
b24413180f License cleanup: add SPDX GPL-2.0 license identifier to files with no license
Many source files in the tree are missing licensing information, which
makes it harder for compliance tools to determine the correct license.

By default all files without license information are under the default
license of the kernel, which is GPL version 2.

Update the files which contain no license information with the 'GPL-2.0'
SPDX license identifier.  The SPDX identifier is a legally binding
shorthand, which can be used instead of the full boiler plate text.

This patch is based on work done by Thomas Gleixner and Kate Stewart and
Philippe Ombredanne.

How this work was done:

Patches were generated and checked against linux-4.14-rc6 for a subset of
the use cases:
 - file had no licensing information it it.
 - file was a */uapi/* one with no licensing information in it,
 - file was a */uapi/* one with existing licensing information,

Further patches will be generated in subsequent months to fix up cases
where non-standard license headers were used, and references to license
had to be inferred by heuristics based on keywords.

The analysis to determine which SPDX License Identifier to be applied to
a file was done in a spreadsheet of side by side results from of the
output of two independent scanners (ScanCode & Windriver) producing SPDX
tag:value files created by Philippe Ombredanne.  Philippe prepared the
base worksheet, and did an initial spot review of a few 1000 files.

The 4.13 kernel was the starting point of the analysis with 60,537 files
assessed.  Kate Stewart did a file by file comparison of the scanner
results in the spreadsheet to determine which SPDX license identifier(s)
to be applied to the file. She confirmed any determination that was not
immediately clear with lawyers working with the Linux Foundation.

Criteria used to select files for SPDX license identifier tagging was:
 - Files considered eligible had to be source code files.
 - Make and config files were included as candidates if they contained >5
   lines of source
 - File already had some variant of a license header in it (even if <5
   lines).

All documentation files were explicitly excluded.

The following heuristics were used to determine which SPDX license
identifiers to apply.

 - when both scanners couldn't find any license traces, file was
   considered to have no license information in it, and the top level
   COPYING file license applied.

   For non */uapi/* files that summary was:

   SPDX license identifier                            # files
   ---------------------------------------------------|-------
   GPL-2.0                                              11139

   and resulted in the first patch in this series.

   If that file was a */uapi/* path one, it was "GPL-2.0 WITH
   Linux-syscall-note" otherwise it was "GPL-2.0".  Results of that was:

   SPDX license identifier                            # files
   ---------------------------------------------------|-------
   GPL-2.0 WITH Linux-syscall-note                        930

   and resulted in the second patch in this series.

 - if a file had some form of licensing information in it, and was one
   of the */uapi/* ones, it was denoted with the Linux-syscall-note if
   any GPL family license was found in the file or had no licensing in
   it (per prior point).  Results summary:

   SPDX license identifier                            # files
   ---------------------------------------------------|------
   GPL-2.0 WITH Linux-syscall-note                       270
   GPL-2.0+ WITH Linux-syscall-note                      169
   ((GPL-2.0 WITH Linux-syscall-note) OR BSD-2-Clause)    21
   ((GPL-2.0 WITH Linux-syscall-note) OR BSD-3-Clause)    17
   LGPL-2.1+ WITH Linux-syscall-note                      15
   GPL-1.0+ WITH Linux-syscall-note                       14
   ((GPL-2.0+ WITH Linux-syscall-note) OR BSD-3-Clause)    5
   LGPL-2.0+ WITH Linux-syscall-note                       4
   LGPL-2.1 WITH Linux-syscall-note                        3
   ((GPL-2.0 WITH Linux-syscall-note) OR MIT)              3
   ((GPL-2.0 WITH Linux-syscall-note) AND MIT)             1

   and that resulted in the third patch in this series.

 - when the two scanners agreed on the detected license(s), that became
   the concluded license(s).

 - when there was disagreement between the two scanners (one detected a
   license but the other didn't, or they both detected different
   licenses) a manual inspection of the file occurred.

 - In most cases a manual inspection of the information in the file
   resulted in a clear resolution of the license that should apply (and
   which scanner probably needed to revisit its heuristics).

 - When it was not immediately clear, the license identifier was
   confirmed with lawyers working with the Linux Foundation.

 - If there was any question as to the appropriate license identifier,
   the file was flagged for further research and to be revisited later
   in time.

In total, over 70 hours of logged manual review was done on the
spreadsheet to determine the SPDX license identifiers to apply to the
source files by Kate, Philippe, Thomas and, in some cases, confirmation
by lawyers working with the Linux Foundation.

Kate also obtained a third independent scan of the 4.13 code base from
FOSSology, and compared selected files where the other two scanners
disagreed against that SPDX file, to see if there was new insights.  The
Windriver scanner is based on an older version of FOSSology in part, so
they are related.

Thomas did random spot checks in about 500 files from the spreadsheets
for the uapi headers and agreed with SPDX license identifier in the
files he inspected. For the non-uapi files Thomas did random spot checks
in about 15000 files.

In initial set of patches against 4.14-rc6, 3 files were found to have
copy/paste license identifier errors, and have been fixed to reflect the
correct identifier.

Additionally Philippe spent 10 hours this week doing a detailed manual
inspection and review of the 12,461 patched files from the initial patch
version early this week with:
 - a full scancode scan run, collecting the matched texts, detected
   license ids and scores
 - reviewing anything where there was a license detected (about 500+
   files) to ensure that the applied SPDX license was correct
 - reviewing anything where there was no detection but the patch license
   was not GPL-2.0 WITH Linux-syscall-note to ensure that the applied
   SPDX license was correct

This produced a worksheet with 20 files needing minor correction.  This
worksheet was then exported into 3 different .csv files for the
different types of files to be modified.

These .csv files were then reviewed by Greg.  Thomas wrote a script to
parse the csv files and add the proper SPDX tag to the file, in the
format that the file expected.  This script was further refined by Greg
based on the output to detect more types of files automatically and to
distinguish between header and source .c files (which need different
comment types.)  Finally Greg ran the script using the .csv files to
generate the patches.

Reviewed-by: Kate Stewart <kstewart@linuxfoundation.org>
Reviewed-by: Philippe Ombredanne <pombredanne@nexb.com>
Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2017-11-02 11:10:55 +01:00
Mikko Perttunen
7afebede62 thermal: Add Tegra BPMP thermal sensor driver
On Tegra186, the BPMP (Boot and Power Management Processor) exposes an
interface to thermal sensors on the system-on-chip. This driver
implements access to the interface. It supports reading the
temperature, setting trip points and receiving notification of a
tripped trip point.

Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
2017-10-19 16:31:47 +02:00
Kunihiko Hayashi
86da439175 thermal: uniphier: add UniPhier thermal driver
Add a thermal driver for on-chip PVT (Process, Voltage and Temperature)
monitoring unit implemented on UniPhier SoCs. This driver supports
temperature monitoring and alert function.

Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 10:49:52 +08:00
Linus Torvalds
6a776e47a0 Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:

 - Fix a problem where orderly_shutdown() is called for multiple times
   due to multiple critical overheating events raised in a short period
   by platform thermal driver. (Keerthy)

 - Introduce a backup thermal shutdown mechanism, which invokes
   kernel_power_off()/emergency_restart() directly, after
   orderly_shutdown() being issued for certain amount of time(specified
   via Kconfig). This is useful in certain conditions that userspace may
   be unable to power off the system in a clean manner and leaves the
   system in a critical state, like in the middle of driver probing
   phase. (Keerthy)

 - Introduce a new interface in thermal devfreq_cooling code so that the
   driver can provide more precise data regarding actual power to the
   thermal governor every time the power budget is calculated. (Lukasz
   Luba)

 - Introduce BCM 2835 soc thermal driver and northstar thermal driver,
   within a new sub-folder. (Rafał Miłecki)

 - Introduce DA9062/61 thermal driver. (Steve Twiss)

 - Remove non-DT booting on TI-SoC driver. Also add support to fetching
   coefficients from DT. (Keerthy)

 - Refactorf RCAR Gen3 thermal driver. (Niklas Söderlund)

 - Small fix on MTK and intel-soc-dts thermal driver. (Dawei Chien,
   Brian Bian)

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits)
  thermal: core: Add a back up thermal shutdown mechanism
  thermal: core: Allow orderly_poweroff to be called only once
  Thermal: Intel SoC DTS: Change interrupt request behavior
  trace: thermal: add another parameter 'power' to the tracing function
  thermal: devfreq_cooling: add new interface for direct power read
  thermal: devfreq_cooling: refactor code and add get_voltage function
  thermal: mt8173: minor mtk_thermal.c cleanups
  thermal: bcm2835: move to the broadcom subdirectory
  thermal: broadcom: ns: specify myself as MODULE_AUTHOR
  thermal: da9062/61: Thermal junction temperature monitoring driver
  Documentation: devicetree: thermal: da9062/61 TJUNC temperature binding
  thermal: broadcom: add Northstar thermal driver
  dt-bindings: thermal: add support for Broadcom's Northstar thermal
  thermal: bcm2835: add thermal driver for bcm2835 SoC
  dt-bindings: Add thermal zone to bcm2835-thermal example
  thermal: rcar_gen3_thermal: add suspend and resume support
  thermal: rcar_gen3_thermal: store device match data in private structure
  thermal: rcar_gen3_thermal: enable hardware interrupts for trip points
  thermal: rcar_gen3_thermal: record and check number of TSCs found
  thermal: rcar_gen3_thermal: check that TSC exists before memory allocation
  ...
2017-05-12 11:58:45 -07:00
Rafał Miłecki
6892cf07e7 thermal: bcm2835: move to the broadcom subdirectory
We already have 2 Broadcom drivers and at least 1 more is coming. This
made us create broadcom subdirectory where bcm2835 should be moves now.

Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-23 08:55:37 -07:00
Steve Twiss
608567aac3 thermal: da9062/61: Thermal junction temperature monitoring driver
Add junction temperature monitoring supervisor device driver, compatible
with the DA9062 and DA9061 PMICs. A MODULE_DEVICE_TABLE() macro is added.

If the PMIC's internal junction temperature rises above T_WARN (125 degC)
an interrupt is issued. This T_WARN level is defined as the
THERMAL_TRIP_HOT trip-wire inside the device driver.

The thermal triggering mechanism is interrupt based and happens when the
temperature rises above a given threshold level. The component cannot
return an exact temperature, it only has knowledge if the temperature is
above or below a given threshold value. A status bit must be polled to
detect when the temperature falls below that threshold level again. A
kernel work queue is configured to repeatedly poll and detect when the
temperature falls below this trip-wire, between 1 and 10 second intervals
(defaulting at 3 seconds).

This scheme is provided as an example. It would be expected that any
final implementation will also include a notify() function and any of these
settings could be altered to match the application where appropriate.

When over-temperature is reached, the interrupt from the DA9061/2 will be
repeatedly triggered. The IRQ is therefore disabled when the first
over-temperature event happens and the status bit is polled using a
work-queue until it becomes false.

This strategy is designed to allow the periodic transmission of uevents
(HOT trip point) as the first level of temperature supervision method. It
is intended for non-invasive temperature control, where the necessary
measures for cooling the system down are left to the host software. Once
the temperature falls again, the IRQ is re-enabled so a new critical
over-temperature event can be detected.

Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-06 21:48:03 -07:00
Rafał Miłecki
a94cb7eeec thermal: broadcom: add Northstar thermal driver
Northstar is a SoC family commonly used in home routers. This commit
adds a driver for checking CPU temperature. As Northstar Plus seems to
also have this IP block this new symbol gets ARCH_BCM_IPROC dependency.

Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Jon Mason <jon.mason@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-06 21:45:19 -07:00
Stefan Wahren
bcb7dd9ef2 thermal: bcm2835: add thermal driver for bcm2835 SoC
Add basic thermal driver for bcm2835 SoC.

This driver currently make sure that tsense HW block is set up
correctly.

Tested-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Martin Sperl <kernel@martin.sperl.org>
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Eric Anholt <eric@anholt.net>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-01 09:30:28 -07:00
Viresh Kumar
19678ffb9f cpufreq: dbx500: Manage cooling device from cpufreq driver
The best place to register the CPU cooling device is from the cpufreq
driver as we would know if all the resources are already available or
not. That's what is done for the cpufreq-dt.c driver as well.

The cpu-cooling driver for dbx500 platform was just (un)registering
with the thermal framework and that can be handled easily by the cpufreq
driver as well and in proper sequence as well.

Get rid of the cooling driver and its its users and manage everything
from the cpufreq driver instead.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Tested-by: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2017-03-16 00:14:31 +01:00
Baoyou Xie
50fdd36f33 thermal: zx2967: add thermal driver for ZTE's zx2967 family
This patch adds thermal driver for ZTE's zx2967 family.

Signed-off-by: Baoyou Xie <baoyou.xie@linaro.org>
Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-02-18 16:36:12 -08:00
Wolfram Sang
564e73d283 thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver
Add support for R-Car Gen3 thermal sensors. Polling only for now,
interrupts will be added incrementally. Same goes for reading fuses.
This is documented already, but no hardware available for now.

Signed-off-by: Hien Dang <hien.dang.eb@renesas.com>
Signed-off-by: Thao Nguyen <thao.nguyen.yb@rvc.renesas.com>
Signed-off-by: Khiem Nguyen <khiem.nguyen.xt@renesas.com>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
[Niklas: document and rework temperature calculation]
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-01-19 20:15:28 -08:00
Eduardo Valentin
cd221c7b63 thermal: core: introduce thermal_helpers.c
Here we have a simple code organization. This patch moves
functions that do not need to handle thermal core internal
data structure to thermal_helpers.c file.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-23 10:06:12 +08:00
Eduardo Valentin
a369ee88f7 thermal: core: move thermal_zone sysfs to thermal_sysfs.c
This is a code reorganization, simply to concentrate
the code handling sysfs in a specific file: thermal_sysfs.c.

Right now, moving only the sysfs entries of thermal_zone_device.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-23 10:06:12 +08:00
Zhang Rui
040a3eadf0 Merge branches 'thermal-soc', 'thermal-core', 'thermal-intel' and 'thermal-tegra-hw-throttle' into next 2016-09-27 14:03:19 +08:00
Laxman Dewangan
ec4664b3fd thermal: max77620: Add thermal driver for reporting junction temp
Maxim Semiconductor Max77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.

Add thermal driver to register PMIC die temperature as thermal
zone sensor and capture the die temperature warning interrupts
to notifying the client.

Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Jia Hongtao
43528445f6 thermal: qoriq: Add thermal management support
This driver add thermal management support by enabling TMU (Thermal
Monitoring Unit) on QorIQ platform.

It's based on thermal of framework:
- Trip points defined in device tree.
- Cpufreq as cooling device registered in qoriq cpufreq driver.

Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Rajendra Nayak
9066073c6c thermal: qcom: tsens: Add a skeletal TSENS drivers
TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.

Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.

Also add the required device tree bindings which can be used
to describe the TSENS device in DT.

Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: Lina Iyer <lina.iyer@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Bin Gao
b474303ffd thermal: add Intel BXT WhiskeyCove PMIC thermal driver
This change adds support for Intel BXT Whiskey Cove PMIC thermal
driver which is intended to handle the alert interrupts triggered
upon thermal trip point cross and notify the thermal framework
appropriately with the zone, temp, crossed trip and event details.

Signed-off-by: Yegnesh S Iyer <yegnesh.s.iyer@intel.com>
Signed-off-by: Bin Gao <bin.gao@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-06 06:55:33 +08:00
Laxman Dewangan
b3aef78f76 thermal: generic-adc: Add ADC based thermal sensor driver
In some of platform, thermal sensors like NCT thermistors are
connected to the one of ADC channel. The temperature is read by
reading the voltage across the sensor resistance via ADC. Lookup
table for ADC read value to temperature is referred to get
temperature. ADC is read via IIO framework.

Add support for thermal sensor driver which read the voltage across
sensor resistance from ADC through IIO framework.

Acked-by: Jonathan Cameron <jic23@kernel.org>
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-05-17 07:28:31 -07:00