3 Commits

Author	SHA1	Message	Date
Pavel Machek	9c5c87e593	ti-soc-thermal: implement omap3 support ... This adds support for OMAP3 chips to ti-soc-thermal. As requested by TI people, it is marked unreliable and warning is printed. Signed-off-by: Pavel Machek <pavel@ucw.cz> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>	2015-09-29 14:08:24 -07:00
Eduardo Valentin	8926fa4f9b	thermal: ti-soc-thermal: add thermal data for DRA752 chips ... This patch adds the thermal data for TI DRA752 chips. In this change it includes (autogen): . Register offset definitions . Bitfields and masks for all registers . Conversion table Also, the thermal limits, thresholds and extrapolation rules are included. The extrapolation rule is simply add +2C as margin. All 5 sensors, MPU, GPU, CORE, DSPEVE and IVA, are defined and exposed. Only MPU has cooling device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>	2013-06-13 10:15:52 +08:00
Eduardo Valentin	eb982001db	thermal: introduce TI SoC thermal driver ... This patch moves the ti-soc-thermal driver out of the staging tree to the thermal tree. Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: Radhesh Fadnis <radhesh.fadnis@ti.com> Cc: Cyril Roelandt <tipecaml@gmail.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devel@driverdev.osuosl.org Cc: linux-pm@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>	2013-05-28 10:40:37 +08:00