Commit Graph

662 Commits

Author SHA1 Message Date
Linus Torvalds
02201e3f1b Minor merge needed, due to function move.
Main excitement here is Peter Zijlstra's lockless rbtree optimization to
 speed module address lookup.  He found some abusers of the module lock
 doing that too.
 
 A little bit of parameter work here too; including Dan Streetman's breaking
 up the big param mutex so writing a parameter can load another module (yeah,
 really).  Unfortunately that broke the usual suspects, !CONFIG_MODULES and
 !CONFIG_SYSFS, so those fixes were appended too.
 
 Cheers,
 Rusty.
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Merge tag 'modules-next-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/rusty/linux

Pull module updates from Rusty Russell:
 "Main excitement here is Peter Zijlstra's lockless rbtree optimization
  to speed module address lookup.  He found some abusers of the module
  lock doing that too.

  A little bit of parameter work here too; including Dan Streetman's
  breaking up the big param mutex so writing a parameter can load
  another module (yeah, really).  Unfortunately that broke the usual
  suspects, !CONFIG_MODULES and !CONFIG_SYSFS, so those fixes were
  appended too"

* tag 'modules-next-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/rusty/linux: (26 commits)
  modules: only use mod->param_lock if CONFIG_MODULES
  param: fix module param locks when !CONFIG_SYSFS.
  rcu: merge fix for Convert ACCESS_ONCE() to READ_ONCE() and WRITE_ONCE()
  module: add per-module param_lock
  module: make perm const
  params: suppress unused variable error, warn once just in case code changes.
  modules: clarify CONFIG_MODULE_COMPRESS help, suggest 'N'.
  kernel/module.c: avoid ifdefs for sig_enforce declaration
  kernel/workqueue.c: remove ifdefs over wq_power_efficient
  kernel/params.c: export param_ops_bool_enable_only
  kernel/params.c: generalize bool_enable_only
  kernel/module.c: use generic module param operaters for sig_enforce
  kernel/params: constify struct kernel_param_ops uses
  sysfs: tightened sysfs permission checks
  module: Rework module_addr_{min,max}
  module: Use __module_address() for module_address_lookup()
  module: Make the mod_tree stuff conditional on PERF_EVENTS || TRACING
  module: Optimize __module_address() using a latched RB-tree
  rbtree: Implement generic latch_tree
  seqlock: Introduce raw_read_seqcount_latch()
  ...
2015-07-01 10:49:25 -07:00
Linus Torvalds
0db9723cac Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
 "Specifics:

   - enhance Thermal Framework with several new capabilities:

       * use power estimates
       * compute weights with relative integers instead of percentages
       * allow governors to have private data in thermal zones
       * export thermal zone parameters through sysfs

     Thanks to the ARM thermal team (Javi, Punit, KP).

   - introduce a new thermal governor: power allocator.  First in kernel
     closed loop PI(D) controller for thermal control.  Thanks to ARM
     thermal team.

   - enhance OF thermal to allow thermal zones to have sustainable power
     HW specification.  Thanks to Punit.

   - introduce thermal driver for Intel Quark SoC x1000platform.  Thanks
     to Ong, Boon Leong.

   - introduce QPNP PMIC temperature alarm driver.  Thanks to Ivan T. I.

   - introduce thermal driver for Hisilicon hi6220.  Thanks to
     kongxinwei.

   - enhance Exynos thermal driver to handle Exynos5433 TMU.  Thanks to
     Chanwoo C.

   - TI thermal driver now has a better implementation for EOCZ bit.
     From Pavel M.

   - add id for Skylake processors in int340x processor thermal driver.

   - a couple of small fixes and cleanups."

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits)
  thermal: hisilicon: add new hisilicon thermal sensor driver
  dt-bindings: Document the hi6220 thermal sensor bindings
  thermal: of-thermal: add support for reading coefficients property
  thermal: support slope and offset coefficients
  thermal: power_allocator: round the division when divvying up power
  thermal: exynos: Add the support for Exynos5433 TMU
  thermal: cpu_cooling: Fix power calculation when CPUs are offline
  thermal: cpu_cooling: Remove cpu_dev update on policy CPU update
  thermal: export thermal_zone_parameters to sysfs
  thermal: cpu_cooling: Check memory allocation of power_table
  ti-soc-thermal: request temperature periodically if hw can't do that itself
  ti-soc-thermal: implement eocz bit to make driver useful on omap3
  cleanup ti-soc-thermal
  thermal: remove stale THERMAL_POWER_ACTOR select
  thermal: Default OF created trip points to writable
  thermal: core: Add Kconfig option to enable writable trips
  thermal: x86_pkg_temp: drop const for thermal_zone_parameters
  of: thermal: Introduce sustainable power for a thermal zone
  thermal: add trace events to the power allocator governor
  thermal: introduce the Power Allocator governor
  ...
2015-06-25 17:51:55 -07:00
Zhang Rui
111b23cf89 Merge branches 'release' and 'thermal-soc' of .git into next 2015-06-11 12:52:14 +08:00
Zhang Rui
53daf9383f Merge branch 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc 2015-06-11 10:55:42 +08:00
kongxinwei
9a5238a9c6 thermal: hisilicon: add new hisilicon thermal sensor driver
This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-06-03 15:58:52 -07:00
Luis R. Rodriguez
9c27847dda kernel/params: constify struct kernel_param_ops uses
Most code already uses consts for the struct kernel_param_ops,
sweep the kernel for the last offending stragglers. Other than
include/linux/moduleparam.h and kernel/params.c all other changes
were generated with the following Coccinelle SmPL patch. Merge
conflicts between trees can be handled with Coccinelle.

In the future git could get Coccinelle merge support to deal with
patch --> fail --> grammar --> Coccinelle --> new patch conflicts
automatically for us on patches where the grammar is available and
the patch is of high confidence. Consider this a feature request.

Test compiled on x86_64 against:

	* allnoconfig
	* allmodconfig
	* allyesconfig

@ const_found @
identifier ops;
@@

const struct kernel_param_ops ops = {
};

@ const_not_found depends on !const_found @
identifier ops;
@@

-struct kernel_param_ops ops = {
+const struct kernel_param_ops ops = {
};

Generated-by: Coccinelle SmPL
Cc: Rusty Russell <rusty@rustcorp.com.au>
Cc: Junio C Hamano <gitster@pobox.com>
Cc: Andrew Morton <akpm@linux-foundation.org>
Cc: Kees Cook <keescook@chromium.org>
Cc: Tejun Heo <tj@kernel.org>
Cc: Ingo Molnar <mingo@kernel.org>
Cc: cocci@systeme.lip6.fr
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Luis R. Rodriguez <mcgrof@suse.com>
Signed-off-by: Rusty Russell <rusty@rustcorp.com.au>
2015-05-28 11:32:10 +09:30
Zhang Rui
e93cd95029 Merge branch 'fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into for-rc 2015-05-19 08:12:27 +08:00
Eduardo Valentin
a46dbae8ab thermal: of-thermal: add support for reading coefficients property
In order to avoid having each driver adding their own
specific DT property to specify slope and offset,
this patch adds a basic coefficient reading from
DT thermal zone node. Right now, as the thermal
framework does not support multiple sensors,
the current coefficients apply only to the only
sensor in the thermal zone.

The supported equation is a simple linear model:
	slope * <sensor reading> + offset.

slope and offset are read from the coefficients
DT property. In the same way as it is described in
the DT thermal binding.

So, as of today, the thermal framework will support
only cases like:
                /* hotspot = 1 * adc + 6000 */
		coefficients =          <1      6000>;

Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-11 19:48:09 -07:00
Eduardo Valentin
9d0be7f481 thermal: support slope and offset coefficients
It is common to have a linear extrapolation from
the current sensor readings and the actual temperature
value. This is specially the case when the sensor
is in use to extrapolate hotspots.

This patch adds slope and offset constants for
single sensor linear extrapolation equation. Because
the same sensor can be use in different locations,
from board to board, these constants are added
as part of thermal_zone_params.

The constants are available through sysfs.

It is up to the device driver to determine
the usage of these values.

Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-11 19:46:52 -07:00
Javi Merino
ea54cac906 thermal: power_allocator: round the division when divvying up power
In situations where there is an uneven number of cooling devices, the
division of power among them can lead to a milliwatt being dropped on
the floor due to rounding errors.  This doesn't sound like a lot, but
some devices only grant the lowest cooling device state for their
maximum power.  So for instance, if the granted_power is the maximum
power and all devices are getting their maximum power, one would get
max_power - 1, making it choose cooling device state 1, instead of 0.

Round the division to make the calculation more accurate.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-11 18:57:44 -07:00
Nadav Haklai
efa86858e1 thermal: armada: Update Armada 380 thermal sensor coefficients
Improve the Armada 380 thermal sensor accuracy by using updated formula.
The updated formula is:
Temperature[C degrees] = 0.4761 * tsen_vsen_out - 279.1

Signed-off-by: Nadav Haklai <nadavh@marvell.com>
Signed-off-by: Gregory CLEMENT <gregory.clement@free-electrons.com>
Cc: <stable@vger.kernel.org> #v3.16
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-09 01:00:31 -07:00
Dan Carpenter
0d0a2bf6ed thermal: rockchip: fix an error code
There is a copy and paste bug, "->clk" vs "->pclk", so we return the
wrong error code here.

Fixes: cbac8f6394 ('thermal: rockchip: add driver for thermal')
Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Reviewed-by: Caesar Wang <wxt@rock-chips.com>
Reviewed-by: Doug Anderson <dianders@chromium.org>
Tested-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-09 13:36:57 +08:00
Jacob Pan
d818611388 thermal/powerclamp: fix missing newer package c-states
Package C8 to C10 was introduced in newer Intel CPUs, we need to
include them in the package c-state residency calculation.
Otherwise, idle injection target is not accurately maintained by
the closed control loop.

Also cleaned up the code to make it scale better with large number
of c-states.

Reported-by: Kristen Carlson Accardi <kristen@linux.intel.com>
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-09 13:36:57 +08:00
Jacob Pan
f09bfdb667 thermal/intel_powerclamp: add id for broadwell server
Broadwell server has support for package C-states, idle injection works
as expected on this platform.

Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-09 13:36:56 +08:00
Mathias Krause
4d2b6e4a9e thermal/intel_powerclamp: add __init / __exit annotations
Mark the module init / exit functions with __init / __exit accodingly.
This allows making the intel_powerclamp_ids[] array __initconst, too, as
it only gets referenced from powerclamp_probe(). This is safe as
file2alias doesn't care about the section, but the symbol name for the
MODULE_DEVICE_TABLE alias.

Cc: Arjan van de Ven <arjan@linux.intel.com>
Cc: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Mathias Krause <minipli@googlemail.com>
Acked-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Acked-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-09 13:36:55 +08:00
Keerthy
e9a90d046b thermal: ti-soc-thermal: OMAP5: Implement Workaround for Errata i813
DESCRIPTION

Spurious Thermal Alert: Talert can happen randomly while the device remains
under the temperature limit defined for this event to trig. This spurious
event is caused by a incorrect re-synchronization between clock domains.
The comparison between configured threshold and current temperature value
can happen while the value is transitioning (metastable), thus causing
inappropriate event generation. No spurious event occurs as long as the
threshold value stays unchanged. Spurious event can be generated while a
thermal alert threshold is modified in
CONTROL_BANDGAP_THRESHOLD_MPU/GPU/CORE/DSPEVE/IVA_n.

WORKAROUND

Spurious event generation can be avoided by performing following sequence
when the threshold is modified:
1. Mask the hot/cold events at the thermal IP level.
2. Modify Threshold.
3. Unmask the hot/cold events at the thermal IP level.

Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-08 18:02:29 -07:00
Keerthy
7901063617 thermal: ti-soc-thermal: dra7: Implement Workaround for Errata i814
Bandgap Temperature read Dtemp can be corrupted

DESCRIPTION
        Read accesses to registers listed below can be corrupted due to
	incorrect resynchronization between clock domains.

        Read access to registers below can be corrupted :
                • CTRL_CORE_DTEMP_MPU/GPU/CORE/DSPEVE/IVA_n (n = 0 to 4)
        • CTRL_CORE_TEMP_SENSOR_MPU/GPU/CORE/DSPEVE/IVA_n

WORKAROUND
    Multiple reads to CTRL_CORE_TEMP_SENSOR_MPU/GPU/CORE/DSPEVE/IVA[9:0]:
    BGAP_DTEMPMPU/GPU/CORE/DSPEVE/IVA is needed to discard false value and
    read right value:
       1. Perform two successive reads to BGAP_DTEMP bit field.
               (a) If read1 returns Val1 and read2 returns Val1, then
       	right value is Val1.
               (b) If read1 returns Val1, read 2 returns Val2, a third
       	read is needed.
       2. Perform third read
               (a) If read3 returns Val2 then right value is Val2.
               (b) If read3 returns Val3, then right value is Val3.

    The above in gist means if val1 and val2 are the same then we can go
    ahead with that value else we need a third read which will be right
    since synchronization will be complete by then.

Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-08 17:55:46 -07:00
Chanwoo Choi
488c7455d7 thermal: exynos: Add the support for Exynos5433 TMU
This patch adds the support for Exynos5433's TMU (Thermal Management Unit).
Exynos5433 has a little different register bit fields as following description:
- Support the eight trip points for rising/falling interrupt by using two registers
- Read the calibration type (1-point or 2-point) and sensor id from TRIMINFO register
- Use a little different register address

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:55 -07:00
Kapileshwar Singh
dd658e0235 thermal: cpu_cooling: Fix power calculation when CPUs are offline
Ensure that the CPU for which the frequency is being requested
is online. If none of the CPUs are online the requested power is
returned as 0.

Acked-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:54 -07:00
Kapileshwar Singh
54b92aae83 thermal: cpu_cooling: Remove cpu_dev update on policy CPU update
It was initially understood that an update to the cpu_device
(cached in cpufreq_cooling_device) was required to ascertain the
correct operating point of the device on a cpufreq policy->cpu update
or creation or deletion of a cpufreq policy.
(e.g. when the existing policy CPU goes offline).

This update is not required and it is possible to ascertain the OPPs
from the leading CPU in a cpufreq domain even if the CPU is hotplugged out.

Fixes: e0128d8ab423 ("thermal: cpu_cooling: implement the power cooling device API")
Acked-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:54 -07:00
Javi Merino
9f38271c6f thermal: export thermal_zone_parameters to sysfs
It's useful for tuning to be able to edit thermal_zone_parameters from
userspace.  Export them to the thermal_zone sysfs so that they can be
easily changed.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:54 -07:00
Javi Merino
0cdf97e1ad thermal: cpu_cooling: Check memory allocation of power_table
We allocate the power_table in memory but we don't test whether the
allocation succeeded.  Return -ENOMEM if kcalloc() fails.

Fixes: e0128d8ab423 ("thermal: cpu_cooling: implement the power cooling device API")
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Reported-by: kbuild test robot <fengguang.wu@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:54 -07:00
Pavel Machek
95d079ef67 ti-soc-thermal: request temperature periodically if hw can't do that itself
When periodic mode is not enabled, it is neccessary to force reads.

Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:54 -07:00
Pavel Machek
a4296d19b5 ti-soc-thermal: implement eocz bit to make driver useful on omap3
For omap3, proper implementation of eocz bit is needed. It was
actually a TODO in the driver.

Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:53 -07:00
Pavel Machek
e34238bf98 cleanup ti-soc-thermal
Simplify code by removing goto's where they point to simple return.

Avoid confusing |= on error values.

Correct whitespace.

Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:53 -07:00
Javi Merino
db6cb88b8f thermal: remove stale THERMAL_POWER_ACTOR select
A previous version of this patch had a config for THERMAL_POWER_ACTOR
but it was dropped.  Remove the select as it is not doing anything.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reported-by: Valentin Rothberg <valentinrothberg@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:53 -07:00
Punit Agrawal
76af5495a5 thermal: Default OF created trip points to writable
When registering a thermal zone from device tree, default the trip
points to writable. By default, only the root user can change these.

This allows the trip points to be tweaked after the system has
booted.

Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:53 -07:00
Punit Agrawal
35e946447f thermal: core: Add Kconfig option to enable writable trips
Add a Kconfig option to allow system integrators to control whether
userspace tools can change trip temperatures. This option overrides
the thermal zone setup in the driver code and must be enabled for
platform specified writable trips to come into effect.

The original behaviour of requiring root privileges to change trip
temperatures remains unchanged.

Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:53 -07:00
Javi Merino
4abe602d5d thermal: x86_pkg_temp: drop const for thermal_zone_parameters
8754d5115693 ("thermal: introduce the Power Allocator governor") dropped
the const attribute in the struct thermal_zone_device.  That means that
the thermal_zone_params pointer passed to thermal_zone_device_register()
also lost the const qualifier.  Drop the const in x86_pkg_temp_thermal.c
as well to avoid the following warning as reported by the kbuild test
robot:

   drivers/thermal/x86_pkg_temp_thermal.c: In function 'pkg_temp_thermal_device_add':
>> drivers/thermal/x86_pkg_temp_thermal.c:450:31: warning: passing argument 6 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type
       phy_dev_entry, &tzone_ops, &pkg_temp_tz_params, 0, 0);
                                  ^
   In file included from drivers/thermal/x86_pkg_temp_thermal.c:30:0:
   include/linux/thermal.h:378:29: note: expected 'struct thermal_zone_params *' but argument is of type 'const struct thermal_zone_params *'
    struct thermal_zone_device *thermal_zone_device_register(const char *, int, int,
                                ^

Cc: Jean Delvare <jdelvare@suse.de>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:53 -07:00
Punit Agrawal
647f99255d of: thermal: Introduce sustainable power for a thermal zone
Introduce an optional property called, sustainable-power, which
represents the power (in mW) which the thermal zone can safely
dissipate.

If provided the property is parsed and associated with the thermal
zone via the thermal zone parameters.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:52 -07:00
Javi Merino
6828a4711f thermal: add trace events to the power allocator governor
Add trace events for the power allocator governor and the power actor
interface of the cpu cooling device.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Frederic Weisbecker <fweisbec@gmail.com>
Cc: Ingo Molnar <mingo@redhat.com>
Acked-by: Steven Rostedt <rostedt@goodmis.org>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:52 -07:00
Javi Merino
6b775e870c thermal: introduce the Power Allocator governor
The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature.  Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.

This governor relies on "power actors", entities that represent heat
sources.  They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.

The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone.  The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control.  It decides how much power to give each cooling device based
on the performance they are requesting.  The PID controller ensures
that the total power budget does not exceed the control temperature.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:52 -07:00
Javi Merino
c36cf07176 thermal: cpu_cooling: implement the power cooling device API
Add a basic power model to the cpu cooling device to implement the
power cooling device API.  The power model uses the current frequency,
current load and OPPs for the power calculations.  The cpus must have
registered their OPPs using the OPP library.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:52 -07:00
Javi Merino
35b11d2e3a thermal: extend the cooling device API to include power information
Add three optional callbacks to the cooling device interface to allow
them to express power.  In addition to the callbacks, add helpers to
identify cooling devices that implement the power cooling device API.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:52 -07:00
Javi Merino
e33df1d2f3 thermal: let governors have private data for each thermal zone
A governor may need to store its current state between calls to
throttle().  That state depends on the thermal zone, so store it as
private data in struct thermal_zone_device.

The governors may have two new ops: bind_to_tz() and unbind_from_tz().
When provided, these functions let governors do some initialization
and teardown when they are bound/unbound to a tz and possibly store that
information in the governor_data field of the struct
thermal_zone_device.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:52 -07:00
Ivan T. Ivanov
c610afaa21 thermal: Add QPNP PMIC temperature alarm driver
Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.

Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.

Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:51 -07:00
Javi Merino
bcdcbbc711 thermal: fair_share: generalize the weight concept
The fair share governor has the concept of weights, which is the
influence of each cooling device in a thermal zone.  The current
implementation forces the weights of all cooling devices in a thermal
zone to add up to a 100.  This complicates setups, as you need to know
in advance how many cooling devices you are going to have.  If you bind a
new cooling device, you have to modify all the other cooling devices
weights, which is error prone.  Furthermore, you can't specify a
"default" weight for platforms since that default value depends on the
number of cooling devices in the platform.

This patch generalizes the concept of weight by allowing any number to
be a "weight".  Weights are now relative to each other.  Platforms that
don't specify weights get the same default value for all their cooling
devices, so all their cdevs are considered to be equally influential.

It's important to note that previous users of the weights don't need to
alter the code: percentages continue to work as they used to.  This
patch just removes the constraint of all the weights in a thermal zone
having to add up to a 100.  If they do, you get the same behavior as
before.  If they don't, fair share now works for that platform.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:51 -07:00
Javi Merino
db91651311 thermal: export weight to sysfs
It's useful to have access to the weights for the cooling devices for
thermal zones and change them if needed.  Export them to sysfs.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:51 -07:00
Javi Merino
80b89172f9 thermal: fair_share: fix typo
s/asscciated/associated/

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:51 -07:00
Javi Merino
8b91e2cb24 thermal: fair_share: use the weight from the thermal instance
The fair share governor is not usable with thermal zones that use the
bind op and don't populate thermal_zone_parameters, the majority of
them.  Now that the weight is in the thermal instance, we can use that
in the fair share governor to allow every thermal zone to trivially use
this governor.  Furthermore, this simplifies the code.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:51 -07:00
Kapileshwar Singh
6cd9e9f629 thermal: of: fix cooling device weights in device tree
Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be.  The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.

Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.

While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:50 -07:00
Joe Perches
ce1d94919d thermal: Use bool function return values of true/false not 1/0
Use the normal return values for bool functions

Signed-off-by: Joe Perches <joe@perches.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-01 13:22:34 +08:00
Dasaratharaman Chandramouli
6a6bcf08e5 intel powerclamp: support Knights Landing
This patch enables intel_powerclamp driver to run on the
next-generation Intel(R) Xeon Phi Microarchitecture
code named "Knights Landing"

Signed-off-by: Dasaratharaman Chandramouli <dasaratharaman.chandramouli@intel.com>
Acked-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-01 11:39:04 +08:00
Brian Bian
383b4d60f6 int340x_thermal/processor_thermal_device: add support to Skylake processors
Add PCI ID of Skylake thermal reporting device.

Signed-off-by: Brian Bian <brian.bian@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-01 11:38:55 +08:00
Wu Fengguang
bd7081ae2b Thermal: Intel SoC: fix simple_return.cocci warnings
drivers/thermal/intel_soc_dts_iosf.c:358:4-7: WARNING: end returns can be simpified

 Simplify a trivial if-return sequence.  Possibly combine with a
 preceding function call.
Generated by: scripts/coccinelle/misc/simple_return.cocci

CC: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Fengguang Wu <fengguang.wu@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-01 11:38:27 +08:00
Ong, Boon Leong
8c18769396 thermal: intel Quark SoC X1000 DTS thermal driver
In Intel Quark SoC X1000, there is one on-die digital temperature sensor(DTS).
The DTS offers both hot & critical trip points.

However, in current distribution of UEFI BIOS for Quark platform, only
critical trip point is configured to be 105 degree Celsius (based on Quark
SW ver1.0.1 and hot trip point is not used due to lack of IRQ.

There is no active cooling device for Quark SoC, so Quark SoC thermal
management logic expects Linux distro to orderly power-off when temperature
of the DTS exceeds the configured critical trip point.

Kernel param "polling_delay" in milliseconds is used to control the frequency
the DTS temperature is read by thermal framework. It defaults to 2-second.
To change it, use kernel boot param "intel_quark_dts_thermal.polling_delay=X".

User interacts with Quark SoC DTS thermal driver through sysfs via:
/sys/class/thermal/thermal_zone0/

For example:
 - to read DTS temperature
   $ cat temp
 - to read critical trip point
   $ cat trip_point_0_temp
 - to read trip point type
   $ cat trip_point_0_type
 - to emulate temperature raise to test orderly shutdown by Linux distro
   $ echo 105 > emul_temp

Tested-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Signed-off-by: Ong Boon Leong <boon.leong.ong@intel.com>
Reviewed-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Reviewed-by: Kweh, Hock Leong <hock.leong.kweh@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-01 11:20:43 +08:00
Srinivas Pandruvada
4d0dd6c157 Thermal/int340x/processor_thermal: Enable auxiliary DTS for Braswell
Support two auxiliary DTS present on Braswell platform using side band
IOSF interface. This supports two read write trips, which can be used
to get notification on trip violation.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2015-05-01 11:20:42 +08:00
Srinivas Pandruvada
3a2419f865 Thermal: Intel SoC: DTS thermal use common APIs
There is no change in functionality but using the common IOSF core APIs.
This driver is now just responsible for enumeration and call relevant
API to create thermal zone and register critical trip.
Also cpuid 0x4c is now handled in the int340x processor thermal driver
with the same functionality.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2015-05-01 11:20:42 +08:00
Srinivas Pandruvada
ee073604db Thermal: Intel SoC: DTS thermal IOSF core
This is becoming a common feature for Intel SoCs to expose the additional
digital temperature sensors (DTSs) using side band interface (IOSF). This
change remove common IOSF DTS handler function from the existing driver
intel_soc_dts_thermal.c and creates a stand alone module, which can
be selected from the SoC specific drivers. In this way there is less
code duplication.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2015-05-01 11:20:42 +08:00
Eduardo Valentin
541d529f98 drivers: thermal: st: remove several sparse warnings
Simple patch to make symbols static. Symbols that are not
shared with other parts of the kernel can be made static.
This change also removes several sparse complains.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Lee Jones <lee.jones@linaro.org>
Cc: Pavel Machek <pavel@ucw.cz>
Cc: Ajit Pal Singh <ajitpal.singh@st.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-04-07 13:43:28 -07:00